Ke Dai

Person

Hangzhou, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Laminated transformer and manufacturing method thereof
- Patent number 12,080,464
- Issue date Sep 3, 2024
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Ke Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supportable package device and package assembly
- Patent number 11,942,263
- Issue date Mar 26, 2024
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Jian Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for power supply module
- Patent number 11,887,942
- Issue date Jan 30, 2024
- Hefei Silergy Semiconductor Technology Co., Ltd.
- Ke Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly and method for manufacturing the same, package ass...
- Patent number 11,302,595
- Issue date Apr 12, 2022
- Hefei Silergy Semiconductor Technology Co., Ltd.
- Ke Dai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LAMINATED TRANSFORMER AND MANUFACTURING METHOD THEREOF
- Publication number 20240404745
- Publication date Dec 5, 2024
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Ke Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC ELEMENT, MANUFACTURING METHOD AND POWER SUPPLY CIRCUIT THE...
- Publication number 20240170194
- Publication date May 23, 2024
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Ke Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR, MANUFACTURING METHOD FOR INDUCTOR, ENCAPSULATION MODULE,...
- Publication number 20240161958
- Publication date May 16, 2024
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Ke Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER AND PACKAGE MODULE
- Publication number 20220254561
- Publication date Aug 11, 2022
- Hefei Silergy Semiconductor Technology Co., Ltd.
- Ke Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER TRANSFORMER AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210193368
- Publication date Jun 24, 2021
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Ke Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR POWER SUPPLY MODULE
- Publication number 20210159194
- Publication date May 27, 2021
- Nanjing Silergy Micro Technology Co., Ltd.
- Ke Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME, PACKAGE ASS...
- Publication number 20210098329
- Publication date Apr 1, 2021
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Ke Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED TRANSFORMER AND MANUFACTURING METHOD THEREOF
- Publication number 20200211759
- Publication date Jul 2, 2020
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Ke Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTABLE PACKAGE DEVICE AND PACKAGE ASSEMBLY
- Publication number 20200152372
- Publication date May 14, 2020
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jian Wei
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Laminated transformer and manufacturing method thereof

Supportable package device and package assembly

Package structure for power supply module

Package assembly and method for manufacturing the same, package ass...

Patents Applicationslast 30 patents

LAMINATED TRANSFORMER AND MANUFACTURING METHOD THEREOF

MAGNETIC ELEMENT, MANUFACTURING METHOD AND POWER SUPPLY CIRCUIT THE...

INDUCTOR, MANUFACTURING METHOD FOR INDUCTOR, ENCAPSULATION MODULE,...

TRANSFORMER AND PACKAGE MODULE

POWER TRANSFORMER AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE FOR POWER SUPPLY MODULE

PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME, PACKAGE ASS...

LAMINATED TRANSFORMER AND MANUFACTURING METHOD THEREOF

SUPPORTABLE PACKAGE DEVICE AND PACKAGE ASSEMBLY