Ke-Jing Yu

Person

Kaohiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Insulating cap on contact structure
- Patent number 12,040,225
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structure with low resistivity and method for forming the same
- Patent number 11,837,663
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating cap on contact structure and method for forming the same
- Patent number 11,393,717
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures of novel contact feature
- Patent number 11,355,603
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using mask layers to facilitate the formation of self-aligned conta...
- Patent number 11,139,203
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structure with low resistivity and method for forming the same
- Patent number 11,081,585
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,018,057
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fu-Hsiang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating cap on contact structure and method for forming the same
- Patent number 10,825,721
- Issue date Nov 3, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structure with low resistivity and method for forming the same
- Patent number 10,693,004
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufactruing Co., Ltd.
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 10,658,237
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fu-Hsiang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures of novel contact feature
- Patent number 10,522,633
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structrues of novel contact feature
- Patent number 9,728,505
- Issue date Aug 8, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SMALL DUMMY POLY PATTERN INSERTION IN SMALL BORDER REGIONS
- Publication number 20250022870
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INSULATING CAP ON CONTACT STRUCTURE
- Publication number 20240339356
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING VIA STRUCTURE WITH LOW RESISTIVITY
- Publication number 20240055522
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING CAP ON CONTACT STRUCTURE
- Publication number 20220319906
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE WITH LOW RESISTIVITY AND METHOD FOR FORMING THE SAME
- Publication number 20210359127
- Publication date Nov 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING CAP ON CONTACT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20210043499
- Publication date Feb 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE WITH LOW RESISTIVITY AND METHOD FOR FORMING THE SAME
- Publication number 20200321460
- Publication date Oct 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20200279774
- Publication date Sep 3, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Hsiang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING CAP ON CONTACT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200126843
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES OF NOVEL CONTACT FEATURE
- Publication number 20200127105
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Using Mask Layers to Facilitate the Formation of Self-Aligned Conta...
- Publication number 20200126857
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE WITH LOW RESISTIVITY AND METHOD FOR FORMING THE SAME
- Publication number 20200058785
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20200043787
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Hsiang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Structures of Novel Contact Feature
- Publication number 20170338319
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTRUES OF NOVEL CONTACT FEATURE
- Publication number 20170141037
- Publication date May 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Insulating cap on contact structure

Via structure with low resistivity and method for forming the same

Insulating cap on contact structure and method for forming the same

Methods and structures of novel contact feature

Using mask layers to facilitate the formation of self-aligned conta...

Via structure with low resistivity and method for forming the same

Semiconductor devices

Insulating cap on contact structure and method for forming the same

Via structure with low resistivity and method for forming the same

Semiconductor devices

Methods and structures of novel contact feature

Methods and structrues of novel contact feature

Patents Applicationslast 30 patents

SMALL DUMMY POLY PATTERN INSERTION IN SMALL BORDER REGIONS

INSULATING CAP ON CONTACT STRUCTURE

METHOD FOR FORMING VIA STRUCTURE WITH LOW RESISTIVITY

INSULATING CAP ON CONTACT STRUCTURE

VIA STRUCTURE WITH LOW RESISTIVITY AND METHOD FOR FORMING THE SAME

INSULATING CAP ON CONTACT STRUCTURE AND METHOD FOR FORMING THE SAME

VIA STRUCTURE WITH LOW RESISTIVITY AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICES

INSULATING CAP ON CONTACT STRUCTURE AND METHOD FOR FORMING THE SAME

METHODS AND STRUCTURES OF NOVEL CONTACT FEATURE

Using Mask Layers to Facilitate the Formation of Self-Aligned Conta...

VIA STRUCTURE WITH LOW RESISTIVITY AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICES

Methods and Structures of Novel Contact Feature

METHODS AND STRUCTRUES OF NOVEL CONTACT FEATURE