Ke Yan Tean

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 12,094,793
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three level interconnect clip
- Patent number 12,057,376
- Issue date Aug 6, 2024
- Infineon Technologies AG
- Azlina Kassim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 11,876,028
- Issue date Jan 16, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device by using different co...
- Patent number 11,804,424
- Issue date Oct 31, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor package with pin fit leads
- Patent number 11,652,078
- Issue date May 16, 2023
- Infineon Technologies AG
- Edmund Sales Cabatbat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor module having a mold step for increasing creep...
- Patent number 11,621,204
- Issue date Apr 4, 2023
- Infineon Technologies AG
- Oliver Markus Kreiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with expanded heat spreader
- Patent number 11,600,547
- Issue date Mar 7, 2023
- Infineon Technologies Austria AG
- Jo Ean Joanna Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clips for semiconductor packages
- Patent number 11,211,353
- Issue date Dec 28, 2021
- Infineon Technologies AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with space efficient lead and die pad design
- Patent number 11,069,600
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240395646
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TR...
- Publication number 20240387305
- Publication date Nov 21, 2024
- INFINEON TECHNOLOGIES AG
- Meng How Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH VACUUM SUCTION ENHANCING INDENTATION ON BACK SIDE OF C...
- Publication number 20240234256
- Publication date Jul 11, 2024
- INFINEON TECHNOLOGIES AG
- Nor Samsiah MARZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, CHIP SYSTEM, METHOD OF FORMING A CHIP PACKAGE, AND ME...
- Publication number 20240087992
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240038612
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE SEMICONDUCTOR PACKAGE WITH PIN FIT LEADS
- Publication number 20220336401
- Publication date Oct 20, 2022
- Edmund Sales Cabatbat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR MODULE HAVING A MOLD STEP FOR INCREASING CREEP...
- Publication number 20220262693
- Publication date Aug 18, 2022
- Oliver Markus Kreiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20220157682
- Publication date May 19, 2022
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Level Interconnect Clip
- Publication number 20220139811
- Publication date May 5, 2022
- Azlina Kassim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Device by Using Different Co...
- Publication number 20210175157
- Publication date Jun 10, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Expanded Heat Spreader
- Publication number 20210166988
- Publication date Jun 3, 2021
- Jo Ean Joanna Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIPS FOR SEMICONDUCTOR PACKAGES
- Publication number 20210043549
- Publication date Feb 11, 2021
- INFINEON TECHNOLOGIES AG
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIPS FOR SEMICONDUCTOR PACKAGES
- Publication number 20210013171
- Publication date Jan 14, 2021
- INFINEON TECHNOLOGIES AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Space Efficient Lead and Die Pad Design
- Publication number 20200373228
- Publication date Nov 26, 2020
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frame Stabilizer for Improved Lead Planarity
- Publication number 20200294896
- Publication date Sep 17, 2020
- Arivindran Navaretnasinggam
- H01 - BASIC ELECTRIC ELEMENTS

Ke Yan Tean

Person

Patents Grantslast 30 patents

Package with electrically insulated carrier and at least one step o...

Three level interconnect clip

Package with electrically insulated carrier and at least one step o...

Method for fabricating a semiconductor device by using different co...

High voltage semiconductor package with pin fit leads

Molded semiconductor module having a mold step for increasing creep...

Semiconductor package with expanded heat spreader

Clips for semiconductor packages

Semiconductor package with space efficient lead and die pad design

Patents Applicationslast 30 patents

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TR...

PACKAGE WITH VACUUM SUCTION ENHANCING INDENTATION ON BACK SIDE OF C...

CHIP PACKAGE, CHIP SYSTEM, METHOD OF FORMING A CHIP PACKAGE, AND ME...

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

HIGH VOLTAGE SEMICONDUCTOR PACKAGE WITH PIN FIT LEADS

MOLDED SEMICONDUCTOR MODULE HAVING A MOLD STEP FOR INCREASING CREEP...

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

Three Level Interconnect Clip

Method for Fabricating a Semiconductor Device by Using Different Co...

Semiconductor Package with Expanded Heat Spreader

CLIPS FOR SEMICONDUCTOR PACKAGES

CLIPS FOR SEMICONDUCTOR PACKAGES

Semiconductor Package with Space Efficient Lead and Die Pad Design

Lead Frame Stabilizer for Improved Lead Planarity