Kean Ming Koe

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Penang, MY

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Patents Grantslast 30 patents

Information Patent Grant
High voltage semiconductor package with pin fit leads
- Patent number 11,652,078
- Issue date May 16, 2023
- Infineon Technologies AG
- Edmund Sales Cabatbat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor module having a mold step for increasing creep...
- Patent number 11,621,204
- Issue date Apr 4, 2023
- Infineon Technologies AG
- Oliver Markus Kreiter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE, CHIP SYSTEM, METHOD OF FORMING A CHIP PACKAGE, AND ME...
- Publication number 20240087992
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE SEMICONDUCTOR PACKAGE WITH PIN FIT LEADS
- Publication number 20220336401
- Publication date Oct 20, 2022
- Edmund Sales Cabatbat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR MODULE HAVING A MOLD STEP FOR INCREASING CREEP...
- Publication number 20220262693
- Publication date Aug 18, 2022
- Oliver Markus Kreiter
- H01 - BASIC ELECTRIC ELEMENTS