Kedar Dhane

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Liquid thermal interface material in electronic packaging
- Patent number 11,581,240
- Issue date Feb 14, 2023
- Intel Corporation
- Kedar Dhane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package that includes multiple supports
- Patent number 10,461,003
- Issue date Oct 29, 2019
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interfaces for integrated circuit packages
- Patent number 10,290,561
- Issue date May 14, 2019
- Intel Corporation
- Edvin Cetegen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component stiffener architectures for microelectronic package struc...
- Patent number 10,157,860
- Issue date Dec 18, 2018
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of stiffeners with thickness variation
- Patent number 9,799,610
- Issue date Oct 24, 2017
- Intel Corporation
- Mingjie Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MAGNETIC MOLD MATERIAL INDUCTORS FOR ELECTRONIC PACKAGES
- Publication number 20200203470
- Publication date Jun 25, 2020
- Intel Corporation
- Kedar Dhane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID THERMAL INTERFACE MATERIAL IN ELECTRONIC PACKAGING
- Publication number 20200203254
- Publication date Jun 25, 2020
- Intel Corporation
- Kedar Dhane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE THAT INCLUDES MULTIPLE SUPPORTS
- Publication number 20180358274
- Publication date Dec 13, 2018
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT STIFFENER ARCHITECTURES FOR MICROELECTRONIC PACKAGE STRUC...
- Publication number 20180182718
- Publication date Jun 28, 2018
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACES FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20180090411
- Publication date Mar 29, 2018
- Intel Corporation
- Edvin Cetegen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, METHODS AND DEVICES FOR STIFFENER CONSTRUCTION FOR USE IN...
- Publication number 20170179043
- Publication date Jun 22, 2017
- Intel Corporation
- Mingjie Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE THAT INCLUDES MULTIPLE SUPPORTS
- Publication number 20170170087
- Publication date Jun 15, 2017
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On Package Floating Metal/Stiffener Grounding to Mitigate RFI and S...
- Publication number 20160268213
- Publication date Sep 15, 2016
- Intel Corporation
- Hongjin JIANG
- H01 - BASIC ELECTRIC ELEMENTS

Kedar Dhane

Person

Patents Grantslast 30 patents

Liquid thermal interface material in electronic packaging

Electronic package that includes multiple supports

Thermal interfaces for integrated circuit packages

Component stiffener architectures for microelectronic package struc...

Plurality of stiffeners with thickness variation

Patents Applicationslast 30 patents

MAGNETIC MOLD MATERIAL INDUCTORS FOR ELECTRONIC PACKAGES

LIQUID THERMAL INTERFACE MATERIAL IN ELECTRONIC PACKAGING

ELECTRONIC PACKAGE THAT INCLUDES MULTIPLE SUPPORTS

COMPONENT STIFFENER ARCHITECTURES FOR MICROELECTRONIC PACKAGE STRUC...

THERMAL INTERFACES FOR INTEGRATED CIRCUIT PACKAGES

SYSTEMS, METHODS AND DEVICES FOR STIFFENER CONSTRUCTION FOR USE IN...

ELECTRONIC PACKAGE THAT INCLUDES MULTIPLE SUPPORTS

On Package Floating Metal/Stiffener Grounding to Mitigate RFI and S...