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Patents Grantslast 30 patents

Information Patent Grant
Seismic acquisition system and sensor based on MEMS sensor with low...
- Patent number 11,472,696
- Issue date Oct 18, 2022
- INSTITUTE OF GEOLOGY AND GEOPHYSICS, CHINESE ACADEMY OF SCIENCES
- Zongwei Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor detection device and MEMS sensor system
- Patent number 11,401,160
- Issue date Aug 2, 2022
- INSTITUTE OF GEOLOGY AND GEOPHYSICS CHINESE ACADEMY OF SCIENCES
- Zongwei Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System-level packaging method and packaging system based on 3D prin...
- Patent number 10,643,862
- Issue date May 5, 2020
- INSTITUTE OF GEOLOGY AND GEOPHYSICS CHINESE ACADEMY OF SCIENCES
- Zongwei Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMS SENSOR DETECTION DEVICE AND MEMS SENSOR SYSTEM
- Publication number 20210130164
- Publication date May 6, 2021
- INSTITUTE OF GEOLOGY AND GEOPHYSICS CHINESE ACADEMY OF SCIENCES
- Zongwei LI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM-LEVEL PACKAGING METHOD AND PACKAGING SYSTEM BASED ON 3D PRIN...
- Publication number 20190228986
- Publication date Jul 25, 2019
- INSTITUTE OF GEOLOGY AND GEOPHYSICS CHINESE ACADEMY OF SCIENCES
- Zongwei LI
- H01 - BASIC ELECTRIC ELEMENTS