Kee-Wei Chung

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HSINCHU COUNTY, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wafer level chip scale package having continuous through hole via c...
- Patent number 9,972,554
- Issue date May 15, 2018
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240055343
- Publication date Feb 15, 2024
- AP MEMORY TECHNOLOGY CORPORATION
- KEE-WEI CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE HAVING CONTINUOUS THROUGH HOLE VIA C...
- Publication number 20170256471
- Publication date Sep 7, 2017
- Powertech Technology Inc.
- Li-Chih Fang
- H01 - BASIC ELECTRIC ELEMENTS