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Patents Grantslast 30 patents

Information Patent Grant
Wafer aligning apparatus and related method
- Patent number 8,600,150
- Issue date Dec 3, 2013
- Samsung Electronics Co., Ltd.
- Heok-Jae Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer aligning apparatus and related method
- Patent number 7,813,542
- Issue date Oct 12, 2010
- Samsung Electronics Co., Ltd.
- Heok-Jae Lee
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
WAFER ALIGNING APPARATUS AND RELATED METHOD
- Publication number 20110050882
- Publication date Mar 3, 2011
- Samsung Electronics Co., Ltd.
- Heok-Jae LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Wafer aligning apparatus and related method
- Publication number 20070189596
- Publication date Aug 16, 2007
- Heok-Jae Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor manufacturing device with transfer robot
- Publication number 20070004058
- Publication date Jan 4, 2007
- Heok-Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS