Keh Chin Seah

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Seberang Perai, MY

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Patents Grantslast 30 patents

Information Patent Grant
Surface mountable semiconductor package with solder bonding features
- Patent number 7,737,546
- Issue date Jun 15, 2010
- Avago Technologies ECBU IP (Singapore) Pte Ltd
- Wai Hoong Moy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED device and method for directing LED light
- Patent number 7,261,441
- Issue date Aug 28, 2007
- Avago Technologies ECBU IP (Singapore) Pte Ltd
- Kee Yean Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive die attachment method for a semiconductor die and arrangem...
- Patent number 6,967,123
- Issue date Nov 22, 2005
- Agilent Technologies, Inc.
- Kee Yean Ng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Surface Mountable Semiconductor Package with Solder Bonding Features
- Publication number 20090057850
- Publication date Mar 5, 2009
- Wai Hoong Moy
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LED device and method for directing LED light
- Publication number 20050190561
- Publication date Sep 1, 2005
- Kee Yean Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive die attachment method for a semiconductor die and arrangem...
- Publication number 20030194831
- Publication date Oct 16, 2003
- Kee Yean Ng
- H01 - BASIC ELECTRIC ELEMENTS