Keh-Fei Chris Chi

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Taipei, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for reducing surface humps of doped amorphous silicon layer
- Patent number 6,403,443
- Issue date Jun 11, 2002
- United Microelectronics Corp.
- Keh-Fei Chris Chi
- H01 - BASIC ELECTRIC ELEMENTS