KEH-YEUAN LI

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Hisinchu, TW

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Patents Applicationslast 30 patents

Information Patent Application
Chemical Mechanical Planarization (CMP) For Copper And Through-Sili...
- Publication number 20240006189
- Publication date Jan 4, 2024
- VERSUM MATERIALS US, LLC
- Xiaobo Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Dishing Copper Chemical Mechanical Planarization
- Publication number 20220332978
- Publication date Oct 20, 2022
- VERSUM MATERIALS US, LLC
- KEH-YEUAN LI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...