Kehong Fang

Person

Dongguan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Resin composition, prepreg for printed circuit and metal-coated lam...
- Patent number 11,970,591
- Issue date Apr 30, 2024
- Shengyi Technology Co., Ltd.
- Yundong Meng
- B32 - LAYERED PRODUCTS
Information Patent Grant
Halogen-free epoxy resin composition, prepreg, laminate and printed...
- Patent number 10,513,605
- Issue date Dec 24, 2019
- SHENGYI TECHNOLOGY CO., LTD.
- Hui Li
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Halogen-free epoxy resin composition, prepreg, laminate and printed...
- Patent number 10,400,099
- Issue date Sep 3, 2019
- SHENGYI TECHNOLOGY CO., LTD.
- Hui Li
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermosetting resin composition and prepreg and laminated board pre...
- Patent number 10,343,383
- Issue date Jul 9, 2019
- Shengyi Technology Co., Ltd.
- Hui Li
- B32 - LAYERED PRODUCTS
Information Patent Grant
Halogen-free resin composition and prepreg and laminate prepared th...
- Patent number 10,336,875
- Issue date Jul 2, 2019
- SHENGYI TECHNOLOGY CO., LTD.
- Hui Li
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Halogen free resin composition and prepreg and laminated board prep...
- Patent number 10,144,824
- Issue date Dec 4, 2018
- SHENGYI TECHNOLOGY CO., LTD.
- Hui Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermoset resin composition, and prepreg and laminate for printed c...
- Patent number 9,670,362
- Issue date Jun 6, 2017
- Shengyi Technology Co., Ltd.
- Yundong Meng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for preparing phosphorus-containing polyphenylene oxide resi...
- Patent number 8,889,816
- Issue date Nov 18, 2014
- Shengyi Technology Co., Ltd.
- Yundong Meng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, PREPREG FOR PRINTED CIRCUIT AND METAL-COATED LAM...
- Publication number 20210403659
- Publication date Dec 30, 2021
- Shengyi Technology Co., Ltd.
- Yundong MENG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLAME-RETARDANT POLYPHENYLENE ETHER RESIN COMPOSITION
- Publication number 20190300649
- Publication date Oct 3, 2019
- Shengyi Technology Co., Ltd.
- Yundong MENG
- B32 - LAYERED PRODUCTS
Information Patent Application
HALOGEN-FREE RESIN COMPOSITION AND PREPREG AND LAMINATE PREPARED TH...
- Publication number 20180327558
- Publication date Nov 15, 2018
- SHENGYI TECHNOLOGY CO., LTD.
- Hui Li
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSET RESIN COMPOSITION, AND PREPREG AND LAMINATED BOARD MADE O...
- Publication number 20180304604
- Publication date Oct 25, 2018
- SHENGYI TECHNOLOGY CO., LTD.
- Kehong Fang
- B32 - LAYERED PRODUCTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR COPPER CLAD LAMINATE, AND APPLICATION O...
- Publication number 20180223093
- Publication date Aug 9, 2018
- Shengyi Technology Co., Ltd.
- Ying XU
- B32 - LAYERED PRODUCTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR COPPER CLAD LAMINATE, AND APPLICATION O...
- Publication number 20180201776
- Publication date Jul 19, 2018
- Shengyi Technology Co.,Ltd.
- Ying XU
- B32 - LAYERED PRODUCTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR COPPER CLAD LAMINATE, AND APPLICATION O...
- Publication number 20180201761
- Publication date Jul 19, 2018
- Shengyi Technology Co., Ltd.
- Ying XU
- B32 - LAYERED PRODUCTS
Information Patent Application
Halogen-Free Epoxy Resin Composition, Prepreg, Laminate and Printed...
- Publication number 20170298218
- Publication date Oct 19, 2017
- Shengyi Technology Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALOGEN-FREE EPOXY RESIN COMPOSITION, PREPREG, LAMINATE AND PRINTED...
- Publication number 20170283610
- Publication date Oct 5, 2017
- Shengyi Technology Co., Ltd.
- Hui LI
- C07 - ORGANIC CHEMISTRY
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATED BOARD PRE...
- Publication number 20170253013
- Publication date Sep 7, 2017
- Shengyi Technology Co., Ltd.
- Hui LI
- B32 - LAYERED PRODUCTS
Information Patent Application
Halogen-Free Resin Composition and Prepreg and Laminated Board Prep...
- Publication number 20170198135
- Publication date Jul 13, 2017
- SHENGYI TECHNOLOGY CO., LTD.
- Hui LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSET RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED C...
- Publication number 20150159016
- Publication date Jun 11, 2015
- Shengyi Technology Co., Ltd.
- Yungdong Meng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PREPARING PHOSPHORUS-CONTAINING POLYPHENYLENE OXIDE RESI...
- Publication number 20140148556
- Publication date May 29, 2014
- Yundong Meng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kehong Fang

Person

Patents Grantslast 30 patents

Resin composition, prepreg for printed circuit and metal-coated lam...

Halogen-free epoxy resin composition, prepreg, laminate and printed...

Halogen-free epoxy resin composition, prepreg, laminate and printed...

Thermosetting resin composition and prepreg and laminated board pre...

Halogen-free resin composition and prepreg and laminate prepared th...

Halogen free resin composition and prepreg and laminated board prep...

Thermoset resin composition, and prepreg and laminate for printed c...

Method for preparing phosphorus-containing polyphenylene oxide resi...

Patents Applicationslast 30 patents

RESIN COMPOSITION, PREPREG FOR PRINTED CIRCUIT AND METAL-COATED LAM...

FLAME-RETARDANT POLYPHENYLENE ETHER RESIN COMPOSITION

HALOGEN-FREE RESIN COMPOSITION AND PREPREG AND LAMINATE PREPARED TH...

THERMOSET RESIN COMPOSITION, AND PREPREG AND LAMINATED BOARD MADE O...

EPOXY RESIN COMPOSITION FOR COPPER CLAD LAMINATE, AND APPLICATION O...

EPOXY RESIN COMPOSITION FOR COPPER CLAD LAMINATE, AND APPLICATION O...

EPOXY RESIN COMPOSITION FOR COPPER CLAD LAMINATE, AND APPLICATION O...

Halogen-Free Epoxy Resin Composition, Prepreg, Laminate and Printed...

HALOGEN-FREE EPOXY RESIN COMPOSITION, PREPREG, LAMINATE AND PRINTED...

THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATED BOARD PRE...

Halogen-Free Resin Composition and Prepreg and Laminated Board Prep...

THERMOSET RESIN COMPOSITION, AND PREPREG AND LAMINATE FOR PRINTED C...

METHOD FOR PREPARING PHOSPHORUS-CONTAINING POLYPHENYLENE OXIDE RESI...