Kei Anai

Person

Saitama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing bonding composition
- Patent number 12,263,523
- Issue date Apr 1, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Composition for pressure bonding, and bonded structure of conductiv...
- Patent number 12,233,463
- Issue date Feb 25, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding material and bonded structure
- Patent number 12,070,801
- Issue date Aug 27, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding sheet and bonded structure
- Patent number 12,046,572
- Issue date Jul 23, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonded body and method for manufacturing same
- Patent number 12,030,125
- Issue date Jul 9, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Conductive film formation composition and method for manufacturing...
- Patent number 12,012,523
- Issue date Jun 18, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for provisional fixation and method for producing bonde...
- Patent number 11,945,974
- Issue date Apr 2, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bonding composition, conductor bonding structure, and method for pr...
- Patent number 11,931,808
- Issue date Mar 19, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Conductive film manufacturing method
- Patent number 11,195,635
- Issue date Dec 7, 2021
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive ink
- Patent number 8,043,535
- Issue date Oct 25, 2011
- Mitsui Mining & Smelting Co., Ltd.
- Yoichi Kamikoriyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
BONDING COMPOSITION, CONDUCTOR BONDING STRUCTURE, AND METHOD FOR PR...
- Publication number 20240181528
- Publication date Jun 6, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
JOINT STRUCTURE
- Publication number 20240149340
- Publication date May 9, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Shinichi YAMAUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CONDUCTIVE COMPOSITION FOR BONDING, BONDING STRUCTURE USING SAME, A...
- Publication number 20240116104
- Publication date Apr 11, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Satoshi KONNO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR PRODUCING BONDING COMPOSITION
- Publication number 20230137716
- Publication date May 4, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING SHEET AND BONDED STRUCTURE
- Publication number 20230005871
- Publication date Jan 5, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITION FOR PROVISIONAL FIXATION AND METHOD FOR PRODUCING BONDE...
- Publication number 20220380639
- Publication date Dec 1, 2022
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MATERIAL AND BONDED STRUCTURE
- Publication number 20220157765
- Publication date May 19, 2022
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDED BODY AND METHOD FOR MANUFACTURING SAME
- Publication number 20220139865
- Publication date May 5, 2022
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR PRESSURE BONDING, AND BONDED STRUCTURE OF CONDUCTIV...
- Publication number 20220118546
- Publication date Apr 21, 2022
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING COMPOSITION, CONDUCTOR BONDING STRUCTURE, AND METHOD FOR PR...
- Publication number 20210138541
- Publication date May 13, 2021
- Kei ANAI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CONDUCTIVE FILM MANUFACTURING METHOD
- Publication number 20210082597
- Publication date Mar 18, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FILM FORMATION COMPOSITION AND METHOD FOR MANUFACTURING...
- Publication number 20200385587
- Publication date Dec 10, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Kei ANAI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Conductive ink
- Publication number 20090293766
- Publication date Dec 3, 2009
- Mitsui Mining & Smelting Co., Ltd.
- Yoichi Kamikoriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive Ink
- Publication number 20080134936
- Publication date Jun 12, 2008
- Mitsui Mining and Smelting Co., Ltd.
- Yoichi Kamikoriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive Paste and Flexible Printed Wiring Board Produced Using t...
- Publication number 20070256857
- Publication date Nov 8, 2007
- Yoichi Kamikoriyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Person

Patents Grantslast 30 patents

Method for producing bonding composition

Composition for pressure bonding, and bonded structure of conductiv...

Bonding material and bonded structure

Bonding sheet and bonded structure

Bonded body and method for manufacturing same

Conductive film formation composition and method for manufacturing...

Composition for provisional fixation and method for producing bonde...

Bonding composition, conductor bonding structure, and method for pr...

Conductive film manufacturing method

Conductive ink

Patents Applicationslast 30 patents

BONDING COMPOSITION, CONDUCTOR BONDING STRUCTURE, AND METHOD FOR PR...

JOINT STRUCTURE

CONDUCTIVE COMPOSITION FOR BONDING, BONDING STRUCTURE USING SAME, A...

METHOD FOR PRODUCING BONDING COMPOSITION

BONDING SHEET AND BONDED STRUCTURE

COMPOSITION FOR PROVISIONAL FIXATION AND METHOD FOR PRODUCING BONDE...

BONDING MATERIAL AND BONDED STRUCTURE

BONDED BODY AND METHOD FOR MANUFACTURING SAME

COMPOSITION FOR PRESSURE BONDING, AND BONDED STRUCTURE OF CONDUCTIV...

BONDING COMPOSITION, CONDUCTOR BONDING STRUCTURE, AND METHOD FOR PR...

CONDUCTIVE FILM MANUFACTURING METHOD

CONDUCTIVE FILM FORMATION COMPOSITION AND METHOD FOR MANUFACTURING...

Conductive ink

Conductive Ink

Conductive Paste and Flexible Printed Wiring Board Produced Using t...