Kei FUKUI

Person

Iizuna, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing board
- Patent number 10,396,020
- Issue date Aug 27, 2019
- Fujitsu Limited
- Kei Fukui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and manufacturing method of wiring substrate
- Patent number 10,109,571
- Issue date Oct 23, 2018
- Fujitsu Limited
- Kei Fukui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit board, method of manufacturing elec...
- Patent number 9,386,700
- Issue date Jul 5, 2016
- Fujitsu Limited
- Kazuya Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing component built-in substrate
- Patent number 9,192,058
- Issue date Nov 17, 2015
- Fujitsu Limited
- Kei Fukui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit board, method of manufacturing elec...
- Patent number 8,959,758
- Issue date Feb 24, 2015
- Fujitsu Limited
- Kazuya Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate unit and method for manufacturing package substra...
- Patent number 8,800,142
- Issue date Aug 12, 2014
- Fujitsu Limited
- Hnin Nway San Nang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BOARD AND METHOD OF MANUFACTURING BOARD
- Publication number 20180315687
- Publication date Nov 1, 2018
- Fujitsu Limited
- Kei FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE
- Publication number 20170103944
- Publication date Apr 13, 2017
- Fujitsu Limited
- Kei FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-MOUNTED BOARD, METHOD OF MANUFACTURING COMPONENT-MOUNTED...
- Publication number 20170020000
- Publication date Jan 19, 2017
- Fujitsu Limited
- TAKATOYO YAMAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING COMPONENT BUILT-IN SUBSTRATE
- Publication number 20150195918
- Publication date Jul 9, 2015
- Fujitsu Limited
- Kei FUKUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD, METHOD OF MANUFACTURING ELEC...
- Publication number 20150124423
- Publication date May 7, 2015
- Fujitsu Limited
- Kazuya ARAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD, METHOD OF MANUFACTURING ELEC...
- Publication number 20120241206
- Publication date Sep 27, 2012
- Fujitsu Limited
- Kazuya ARAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package substrate unit and method for manufacturing package substra...
- Publication number 20120067635
- Publication date Mar 22, 2012
- FUJITSU LIMITED
- Hnin Nway San Nang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Method of manufacturing board

Wiring substrate and manufacturing method of wiring substrate

Method of manufacturing circuit board, method of manufacturing elec...

Method for manufacturing component built-in substrate

Method of manufacturing circuit board, method of manufacturing elec...

Package substrate unit and method for manufacturing package substra...

Patents Applicationslast 30 patents

BOARD AND METHOD OF MANUFACTURING BOARD

WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE

COMPONENT-MOUNTED BOARD, METHOD OF MANUFACTURING COMPONENT-MOUNTED...

METHOD FOR MANUFACTURING COMPONENT BUILT-IN SUBSTRATE

METHOD OF MANUFACTURING CIRCUIT BOARD, METHOD OF MANUFACTURING ELEC...

METHOD OF MANUFACTURING CIRCUIT BOARD, METHOD OF MANUFACTURING ELEC...

Package substrate unit and method for manufacturing package substra...