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Kei HAYASHI

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor package with a plurality of chips having a groove in...
    • Patent number 11,450,592
    • Issue date Sep 20, 2022
    • Mitsubishi Electric Corporation
    • Hiroya Sannai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 10,193,323
    • Issue date Jan 29, 2019
    • Mitsubishi Electric Corporation
    • Kei Hayashi
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Grant

    Buffer circuit
    • Patent number 9,843,318
    • Issue date Dec 12, 2017
    • Mitsubishi Electric Corporation
    • Kei Hayashi
    • H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents