Kei IMAFUJI

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 12,057,384
- Issue date Aug 6, 2024
- Shinko Electric Industries Co., Ltd.
- Hiroshi Taneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible substrate and semiconductor apparatus
- Patent number 11,605,585
- Issue date Mar 14, 2023
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and semiconductor device
- Patent number 10,438,883
- Issue date Oct 8, 2019
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection substrate and semiconductor package
- Patent number 9,935,043
- Issue date Apr 3, 2018
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,899,304
- Issue date Feb 20, 2018
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 9,545,016
- Issue date Jan 10, 2017
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure, wiring substrate, semiconductor apparatus and bump...
- Patent number 9,485,864
- Issue date Nov 1, 2016
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 9,210,807
- Issue date Dec 8, 2015
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,084,339
- Issue date Jul 14, 2015
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,901,997
- Issue date Mar 8, 2011
- Shinko Electric Industries Co., Ltd.
- Takashi Ozawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump forming method
- Patent number 7,807,560
- Issue date Oct 5, 2010
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-cyanide electroless gold plating solution and process for elect...
- Patent number 7,264,848
- Issue date Sep 4, 2007
- Shinko Electric Industries Co., Ltd.
- Masaki Sanada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Non-cyanogen type electrolytic solution for plating gold
- Patent number 7,261,803
- Issue date Aug 28, 2007
- Shinko Electric Industries Co., Ltd.
- Miwa Abe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for producing wiring substrate
- Patent number 7,093,356
- Issue date Aug 22, 2006
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20220157697
- Publication date May 19, 2022
- Shinko Electric Industries Co., LTD.
- Hiroshi TANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SUBSTRATE AND SEMICONDUCTOR APPARATUS
- Publication number 20220130739
- Publication date Apr 28, 2022
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20180182701
- Publication date Jun 28, 2018
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION SUBSTRATE AND SEMICONDUCTOR PACKAGE
- Publication number 20180096926
- Publication date Apr 5, 2018
- Shinko Electric Industries Co., Ltd.
- Kei IMAFUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20170186677
- Publication date Jun 29, 2017
- Shinko Electric Industries Co., Ltd.
- KEI IMAFUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20150305153
- Publication date Oct 22, 2015
- Shinko Electric Industries Co., Ltd.
- Kei IMAFUJI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP STRUCTURE, WIRING SUBSTRATE, SEMICONDUCTOR APPARATUS AND BUMP...
- Publication number 20150029689
- Publication date Jan 29, 2015
- Shinko Electric Industries Co., Ltd.
- Kei IMAFUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20140138134
- Publication date May 22, 2014
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130284499
- Publication date Oct 31, 2013
- Shinko Electric Industries Co., Ltd.
- Kei IMAFUJI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BUMP FORMING METHOD
- Publication number 20090023281
- Publication date Jan 22, 2009
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20080188040
- Publication date Aug 7, 2008
- Shinko Electric Industries Co., Ltd.
- Takashi Ozawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Non-cyanogen type electrolytic solution for plating gold
- Publication number 20070029206
- Publication date Feb 8, 2007
- Shinko Electric Industries Co., Ltd.
- Miwa Abe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Non-cyanide electroless gold plating solution and process for elect...
- Publication number 20060062927
- Publication date Mar 23, 2006
- Shinko Electric Industries Co., Ltd.
- Masaki Sanada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Non-cyanogen type electrolytic solution for plating gold
- Publication number 20040069641
- Publication date Apr 15, 2004
- Shinko Electric Industries Co., Ltd.
- Miwa Abe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for producing wiring substrate
- Publication number 20040060174
- Publication date Apr 1, 2004
- Shinko Electric Industries Co. Ltd
- Kei Imafuji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Kei IMAFUJI

Person

Patents Grantslast 30 patents

Wiring substrate and semiconductor device

Flexible substrate and semiconductor apparatus

Wiring board and semiconductor device

Interconnection substrate and semiconductor package

Wiring substrate and semiconductor device

Wiring substrate and method for manufacturing wiring substrate

Bump structure, wiring substrate, semiconductor apparatus and bump...

Wiring substrate

Wiring substrate and method of manufacturing the same

Method of manufacturing semiconductor device

Solder bump forming method

Non-cyanide electroless gold plating solution and process for elect...

Non-cyanogen type electrolytic solution for plating gold

Method for producing wiring substrate

Patents Applicationslast 30 patents

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

FLEXIBLE SUBSTRATE AND SEMICONDUCTOR APPARATUS

WIRING BOARD AND SEMICONDUCTOR DEVICE

INTERCONNECTION SUBSTRATE AND SEMICONDUCTOR PACKAGE

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

BUMP STRUCTURE, WIRING SUBSTRATE, SEMICONDUCTOR APPARATUS AND BUMP...

WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

SOLDER BUMP FORMING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Non-cyanogen type electrolytic solution for plating gold

Non-cyanide electroless gold plating solution and process for elect...

Non-cyanogen type electrolytic solution for plating gold

Method for producing wiring substrate