Kei Murayama

Person

Nagago-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,817,381
- Issue date Nov 14, 2023
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wiring substrate and semiconductor device
- Patent number 11,706,877
- Issue date Jul 18, 2023
- Shinko Electric Industries Co., Ltd.
- Shota Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, stacked wiring substrate, and manufacturing metho...
- Patent number 10,959,328
- Issue date Mar 23, 2021
- SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Naoki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,784,226
- Issue date Sep 22, 2020
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive ball and electronic device
- Patent number 10,446,512
- Issue date Oct 15, 2019
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive ball having a tin-based solder covering an outer surface...
- Patent number 10,446,513
- Issue date Oct 15, 2019
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, heat conductor, and method for manufacturing...
- Patent number 9,716,053
- Issue date Jul 25, 2017
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and electronic component device
- Patent number 9,633,964
- Issue date Apr 25, 2017
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor device including the same
- Patent number 9,591,742
- Issue date Mar 7, 2017
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and electronic component package
- Patent number 9,374,889
- Issue date Jun 21, 2016
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 9,179,568
- Issue date Nov 3, 2015
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump joining structure with low resistance joining member
- Patent number 9,129,884
- Issue date Sep 8, 2015
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure, wiring substrate unit, electronic circuit par...
- Patent number 9,105,989
- Issue date Aug 11, 2015
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor device and method of manufacturing the same
- Patent number 8,841,760
- Issue date Sep 23, 2014
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,836,119
- Issue date Sep 16, 2014
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat radiation component and semiconductor package including same
- Patent number 8,674,499
- Issue date Mar 18, 2014
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Frame-attached anti-reflection glass and method of manufacturing th...
- Patent number 8,622,556
- Issue date Jan 7, 2014
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- G02 - OPTICS
Information Patent Grant
Semiconductor device, and method of manufacturing the same
- Patent number 8,598,684
- Issue date Dec 3, 2013
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and method for manufacturing the same
- Patent number 8,481,863
- Issue date Jul 9, 2013
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip stacked body and method of manufacturing the same
- Patent number 8,394,678
- Issue date Mar 12, 2013
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat radiation package and semiconductor device
- Patent number 8,368,206
- Issue date Feb 5, 2013
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 8,350,390
- Issue date Jan 8, 2013
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor chip including a semiconduc...
- Patent number 8,338,289
- Issue date Dec 25, 2012
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board having heat intercepting member
- Patent number 8,330,050
- Issue date Dec 11, 2012
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,227,909
- Issue date Jul 24, 2012
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 8,183,469
- Issue date May 22, 2012
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component device, and method of manufacturing the same
- Patent number 8,178,957
- Issue date May 15, 2012
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and electronic apparatus of multi-chip packaging
- Patent number 8,169,073
- Issue date May 1, 2012
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an element mounted on a substrate and a...
- Patent number 8,148,738
- Issue date Apr 3, 2012
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 8,137,497
- Issue date Mar 20, 2012
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174505
- Publication date May 29, 2025
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE
- Publication number 20250167096
- Publication date May 22, 2025
- Shinko Electric Industries Co., Ltd.
- Makoto Tsukahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20250120010
- Publication date Apr 10, 2025
- Shinko Electric Industries Co., Ltd.
- Tatsuki Sumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079379
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20250070036
- Publication date Feb 27, 2025
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND SEMICONDUCTO...
- Publication number 20240234278
- Publication date Jul 11, 2024
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND SEMICONDUCTO...
- Publication number 20240136265
- Publication date Apr 25, 2024
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230207443
- Publication date Jun 29, 2023
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20220361342
- Publication date Nov 10, 2022
- Shinko Electric Industries Co., Ltd.
- Shota MIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220028774
- Publication date Jan 27, 2022
- SHINKO ELECTRIC INDUSTRIES, CO., LTD.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, STACKED WIRING SUBSTRATE, AND MANUFACTURING METHO...
- Publication number 20210007220
- Publication date Jan 7, 2021
- Shinko Electric Industries Co., Ltd.
- Naoki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190371757
- Publication date Dec 5, 2019
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BALL AND ELECTRONIC DEVICE
- Publication number 20190013286
- Publication date Jan 10, 2019
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BALL AND ELECTRONIC DEVICE
- Publication number 20190013285
- Publication date Jan 10, 2019
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE
- Publication number 20160276301
- Publication date Sep 22, 2016
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, HEAT CONDUCTOR, AND METHOD FOR MANUFACTURING...
- Publication number 20150327397
- Publication date Nov 12, 2015
- Shinko Electric Industries Co., LTD.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150091162
- Publication date Apr 2, 2015
- Shinko Electric Industries Co., LTD.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20140362552
- Publication date Dec 11, 2014
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND ELECTRONIC COMPONENT PACKAGE
- Publication number 20140293564
- Publication date Oct 2, 2014
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140042616
- Publication date Feb 13, 2014
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130329385
- Publication date Dec 12, 2013
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE, WIRING SUBSTRATE UNIT, ELECTRONIC CIRCUIT PAR...
- Publication number 20130284509
- Publication date Oct 31, 2013
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130264695
- Publication date Oct 10, 2013
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRAME-ATTACHED ANTI-REFLECTION GLASS AND METHOD OF MANUFACTURING TH...
- Publication number 20120154918
- Publication date Jun 21, 2012
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- G02 - OPTICS
Information Patent Application
HEAT RADIATION COMPONENT AND SEMICONDUCTOR PACKAGE INCLUDING SAME
- Publication number 20110291258
- Publication date Dec 1, 2011
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SILICON SUBSTRATE FOR PACKAGE
- Publication number 20110227218
- Publication date Sep 22, 2011
- Shinko Electric Industries Co., Ltd.
- Akinori Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110156242
- Publication date Jun 30, 2011
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20110147951
- Publication date Jun 23, 2011
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME
- Publication number 20110062596
- Publication date Mar 17, 2011
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110032710
- Publication date Feb 10, 2011
- Shinko Electric Industries Co., Ltd.
- Mitsutoshi Higashi
- H01 - BASIC ELECTRIC ELEMENTS

Kei Murayama

Person

Patents Grantslast 30 patents

Semiconductor device

Composite wiring substrate and semiconductor device

Wiring substrate, stacked wiring substrate, and manufacturing metho...

Semiconductor device

Conductive ball and electronic device

Conductive ball having a tin-based solder covering an outer surface...

Semiconductor device, heat conductor, and method for manufacturing...

Wiring substrate and electronic component device

Interposer and semiconductor device including the same

Interposer and electronic component package

Electronic device

Solder bump joining structure with low resistance joining member

Connection structure, wiring substrate unit, electronic circuit par...

Stacked semiconductor device and method of manufacturing the same

Semiconductor device

Heat radiation component and semiconductor package including same

Frame-attached anti-reflection glass and method of manufacturing th...

Semiconductor device, and method of manufacturing the same

Substrate and method for manufacturing the same

Semiconductor chip stacked body and method of manufacturing the same

Heat radiation package and semiconductor device

Wiring substrate and semiconductor device

Method of manufacturing a semiconductor chip including a semiconduc...

Wiring board having heat intercepting member

Semiconductor package and method of manufacturing the same

Wiring board and method of manufacturing the same

Electronic component device, and method of manufacturing the same

Semiconductor device and electronic apparatus of multi-chip packaging

Semiconductor device having an element mounted on a substrate and a...

Method of manufacturing wiring substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

INTERCONNECT SUBSTRATE

WIRING BOARD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR APPARATUS

INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND SEMICONDUCTO...

INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND SEMICONDUCTO...

SEMICONDUCTOR DEVICE

COMPOSITE WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

WIRING SUBSTRATE, STACKED WIRING SUBSTRATE, AND MANUFACTURING METHO...

SEMICONDUCTOR DEVICE

CONDUCTIVE BALL AND ELECTRONIC DEVICE

CONDUCTIVE BALL AND ELECTRONIC DEVICE

WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE

SEMICONDUCTOR DEVICE, HEAT CONDUCTOR, AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR DEVICE

INTERPOSER AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

INTERPOSER AND ELECTRONIC COMPONENT PACKAGE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

CONNECTION STRUCTURE, WIRING SUBSTRATE UNIT, ELECTRONIC CIRCUIT PAR...

STACKED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

FRAME-ATTACHED ANTI-REFLECTION GLASS AND METHOD OF MANUFACTURING TH...

HEAT RADIATION COMPONENT AND SEMICONDUCTOR PACKAGE INCLUDING SAME

SILICON SUBSTRATE FOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME