Kei Nakamura

Person

  • Osaka, JP

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SOLAR BATTERY MODULE

    • Publication number 20170179322
    • Publication date Jun 22, 2017
    • Panasonic Intellectual Property Management Co., Lt d.
    • Kei Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING SOLAR CELL MODULE

    • Publication number 20170148941
    • Publication date May 25, 2017
    • Panasonic Intellectual Property Management Co., Ltd.
    • Masaharu TAKENAKA
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    SOLAR CELL MODULE

    • Publication number 20160308082
    • Publication date Oct 20, 2016
    • Panasonic Intellectual Property Management Co., Ltd.
    • Yousuke ISHII
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    SOLAR CELL MODULE MANUFACTURING METHOD

    • Publication number 20160197219
    • Publication date Jul 7, 2016
    • Panasonic Intellectual Property Management Co., Lt d.
    • Masaharu TAKENAKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SOLAR CELL MODULE

    • Publication number 20160172520
    • Publication date Jun 16, 2016
    • Panasonic Intellectual Property Management Co., Ltd.
    • Kei NAKAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INPUT DEVICE

    • Publication number 20130048834
    • Publication date Feb 28, 2013
    • Nitto Denko Corporation
    • Toru Mizutani
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    OPTICAL SENSOR MODULE

    • Publication number 20120201490
    • Publication date Aug 9, 2012
    • Nitto Denko Corporation
    • Ryusuke Naito
    • G02 - OPTICS
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MAGNETIC HEAD DRIVING DEVICE INCLUDING TH...

    • Publication number 20100277835
    • Publication date Nov 4, 2010
    • Nitto Denko Corporation
    • Mitsuru Honjo
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    Wired circuit board and method for manufacturing wired circuit boar...

    • Publication number 20090242506
    • Publication date Oct 1, 2009
    • Nitto Denko Corporation
    • Kei Nakamura
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Wired circuit board

    • Publication number 20090114426
    • Publication date May 7, 2009
    • Nitto Denko Corporation
    • Makoto Tsunekawa
    • G01 - MEASURING TESTING
  • Information Patent Application

    METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

    • Publication number 20080164236
    • Publication date Jul 10, 2008
    • Nitto Denko Corporation
    • Kei Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wired circuit board and method for manufacturing wired circuit boar...

    • Publication number 20070108631
    • Publication date May 17, 2007
    • Nitto Denko Corporation
    • Kei Nakamura
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Tab tape carrier

    • Publication number 20070023876
    • Publication date Feb 1, 2007
    • Nitto Denko Corporation
    • Kei Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20070000689
    • Publication date Jan 4, 2007
    • Nitto Denko Corporation
    • Yasuto ISHIMARU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Printed circuit board and method for manufacturing printed circuit...

    • Publication number 20060000637
    • Publication date Jan 5, 2006
    • NITTO DENKO CORPORATION
    • Kei Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wired circuit board

    • Publication number 20050260391
    • Publication date Nov 24, 2005
    • Nitto Denko Corporation
    • Kei Nakamura
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Wired circuit board and production method thereof

    • Publication number 20050244620
    • Publication date Nov 3, 2005
    • Nitto Denko Corporation
    • Makoto Tsunekawa
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method of producing multilayer wired circuit board

    • Publication number 20050079652
    • Publication date Apr 14, 2005
    • NITTO DENKO CORPORATION
    • Mineyoshi Hasegawa
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Multilayer flexible wiring circuit board and its manufacturing method

    • Publication number 20040035520
    • Publication date Feb 26, 2004
    • Kei Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method for producing multilayer wiring circuit board

    • Publication number 20040011855
    • Publication date Jan 22, 2004
    • Kei Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Double-sided circuit board and multilayer wiring board comprising t...

    • Publication number 20010004944
    • Publication date Jun 28, 2001
    • Kei Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR