TREA

Kei NAKAYAMA

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method for etching copper layer
    • Patent number 9,803,286
    • Issue date Oct 31, 2017
    • Tokyo Electron Limited
    • Eiichi Nishimura
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Method for etching insulation film
    • Patent number 9,312,105
    • Issue date Apr 12, 2016
    • Tokyo Electron Limited
    • Akira Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD FOR ETCHING INSULATION FILM
    • Publication number 20150371830
    • Publication date Dec 24, 2015
    • TOKYO ELECTRON LIMITED
    • Akira TAKAHASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR ETCHING COPPER LAYER
    • Publication number 20150104951
    • Publication date Apr 16, 2015
    • TOKYO ELECTRON LIMITED
    • Eiichi NISHIMURA
    • H01 - BASIC ELECTRIC ELEMENTS