Keigo Obata

Person

Himeji, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Silver and silver alloy plating bath
- Patent number 7,938,948
- Issue date May 10, 2011
- Ishihara Chemical Co., LTD
- Kiyotaka Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Flux for soldering and circuit board
- Patent number 7,669,752
- Issue date Mar 2, 2010
- Harima Chemicals, Inc.
- Kazuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silver and silver alloy plating bath
- Patent number 7,628,903
- Issue date Dec 8, 2009
- Ishihara Chemical Co., LTD
- Kiyotaka Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Pretreatment solution for providing catalyst for electroless platin...
- Patent number 7,166,152
- Issue date Jan 23, 2007
- Daiwa Fine Chemicals Co., Ltd.
- Yoshiaki Okuhama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming circuit pattern
- Patent number 7,056,448
- Issue date Jun 6, 2006
- Daiwa Fine Chemicals Co., Ltd.
- Yoshiaki Okuhama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solder precipitating composition
- Patent number 6,923,875
- Issue date Aug 2, 2005
- Harima Chemicals, Inc.
- Kazuki Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating method and plating bath precursor used therefor
- Patent number 6,852,210
- Issue date Feb 8, 2005
- Daiwa Fine Chemicals Co., Ltd.
- Keigo Obata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating bath and process for depositing alloy containing tin and co...
- Patent number 6,607,653
- Issue date Aug 19, 2003
- Daiwa Fine Chemicals Co., Ltd.
- Kiyotaka Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Redox system electroless plating method
- Patent number 6,338,787
- Issue date Jan 15, 2002
- Daiwa Fine Chemicals Co., Ltd.
- Keigo Obata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Aqueous solutions for obtaining noble metals by chemical reductive...
- Patent number 6,235,093
- Issue date May 22, 2001
- Daiwa Fine Chemicals Co., Ltd.
- Yoshiaki Okuhama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Aqueous solutions for obtaining metals by reductive deposition
- Patent number 6,183,545
- Issue date Feb 6, 2001
- Daiwa Fine Chemicals Co., Ltd.
- Yoshiaki Okuhama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Brush for electrolytic treatment
- Patent number 4,992,154
- Issue date Feb 12, 1991
- Marui Mekki Kogyo Yugen Kaisha
- Yoshiaki Ida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin, lead, or tin-lead alloy plating bath
- Patent number 4,673,470
- Issue date Jun 16, 1987
- Obata; Keigo
- Keigo Obata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin-lead alloy plating bath
- Patent number 4,555,314
- Issue date Nov 26, 1985
- Obata, Dohi, Daiwa Fine Chemicals Co. Ltd.
- Keigo Obata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin, lead, and tin-lead alloy plating baths
- Patent number 4,459,185
- Issue date Jul 10, 1984
- Obata, Doni, Daiwa, Fine Chemicals Co., Ltd.
- Keigo Obata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of bright electroplating of tin-lead alloy
- Patent number 4,132,610
- Issue date Jan 2, 1979
- Hyogo Prefectural Government
- Nobuyasu Dohi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
SILVER AND SILVER ALLOY PLATING BATH
- Publication number 20090321269
- Publication date Dec 31, 2009
- ISHIHARA CHEMICAL CO., LTD.
- Kiyotaka TSUJI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FLUX FOR SOLDERING AND CIRCUIT BOARD
- Publication number 20070241170
- Publication date Oct 18, 2007
- HARIMA CHEMICALS, INC.
- Kazuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux for soldering and circuit board
- Publication number 20060147683
- Publication date Jul 6, 2006
- HARIMA CHEMICALS, INC.
- Kazuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tin-containing plating bath
- Publication number 20060113006
- Publication date Jun 1, 2006
- Akihiro Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for forming circuit pattern
- Publication number 20050258134
- Publication date Nov 24, 2005
- DAIWA FINE CHEMICALS CO., LTD.
- Yoshiaki Okuhama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Pretreatment solution for providing catalyst for electroless platin...
- Publication number 20040043153
- Publication date Mar 4, 2004
- DAIWA FINE CHEMICALS CO., LTD.
- Yoshiaki Okuhama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Solder precipitating composition and solder precipitation method
- Publication number 20030159761
- Publication date Aug 28, 2003
- HARIMA CHEMICALS, INC.
- Kazuki Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tin or tin alloy plating bath, tin salt solution and acid or comple...
- Publication number 20030150743
- Publication date Aug 14, 2003
- DAIWA FINE CHEMICALS CO., LTD.
- Keigo Obata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating method and plating bath precursor used therefor
- Publication number 20020079226
- Publication date Jun 27, 2002
- DAIWA FINE CHEMICALS CO., LTD.
- Keigo Obata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Keigo Obata

Person

Patents Grantslast 30 patents

Silver and silver alloy plating bath

Flux for soldering and circuit board

Silver and silver alloy plating bath

Pretreatment solution for providing catalyst for electroless platin...

Method for forming circuit pattern

Solder precipitating composition

Plating method and plating bath precursor used therefor

Plating bath and process for depositing alloy containing tin and co...

Redox system electroless plating method

Aqueous solutions for obtaining noble metals by chemical reductive...

Aqueous solutions for obtaining metals by reductive deposition

Brush for electrolytic treatment

Tin, lead, or tin-lead alloy plating bath

Tin-lead alloy plating bath

Tin, lead, and tin-lead alloy plating baths

Method of bright electroplating of tin-lead alloy

Patents Applicationslast 30 patents

SILVER AND SILVER ALLOY PLATING BATH

FLUX FOR SOLDERING AND CIRCUIT BOARD

Flux for soldering and circuit board

Tin-containing plating bath

Method for forming circuit pattern

Pretreatment solution for providing catalyst for electroless platin...

Solder precipitating composition and solder precipitation method

Tin or tin alloy plating bath, tin salt solution and acid or comple...

Plating method and plating bath precursor used therefor