Membership
Tour
Register
Log in
Keiichi Endoh
Follow
Person
Okayama, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Bonding material and bonding method using same
Patent number
12,048,964
Issue date
Jul 30, 2024
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Joining material and joining method using same
Patent number
11,453,053
Issue date
Sep 27, 2022
Dowa Electronics Materials Co., Ltd.
Satoru Kurita
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Bonding material and bonding method using same
Patent number
10,903,185
Issue date
Jan 26, 2021
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Bonding material and bonding method using same
Patent number
10,821,558
Issue date
Nov 3, 2020
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Bonding material and bonding method using same
Patent number
10,543,569
Issue date
Jan 28, 2020
Dowa Electronics Materials Co., Ltd.
Satoru Kurita
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding material and bonding method using same
Patent number
10,328,534
Issue date
Jun 25, 2019
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Bonding method using bonding material
Patent number
10,090,275
Issue date
Oct 2, 2018
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding material and bonding method using the same
Patent number
10,008,471
Issue date
Jun 26, 2018
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Metal nanoparticle dispersion, method for producing metal nanoparti...
Patent number
9,662,748
Issue date
May 30, 2017
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding material and bonding method in which said bonding material...
Patent number
9,533,380
Issue date
Jan 3, 2017
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding material and bonding body, and bonding method
Patent number
9,486,879
Issue date
Nov 8, 2016
Dowa Electronics Materials Co., Ltd.
Satoru Kurita
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding material and bonding method using the same
Patent number
9,240,256
Issue date
Jan 19, 2016
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Bonding material using metal nanoparticles coated with C6-C8 fatty...
Patent number
8,858,700
Issue date
Oct 14, 2014
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Low-temperature-sinterable bonding material, and bonding method usi...
Patent number
8,641,929
Issue date
Feb 4, 2014
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B82 - NANO-TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
METAL PASTE FOR BONDING AND BONDING METHOD
Publication number
20230311249
Publication date
Oct 5, 2023
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi ENDOH
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING MATERIAL AND BONDING METHOD EMPLOYING SAME
Publication number
20200094318
Publication date
Mar 26, 2020
DOWA ELECTRONICS MATERIALS CO., LTD.
Hideyuki FUJIMOTO
B22 - CASTING POWDER METALLURGY
Information
Patent Application
BONDING MATERIAL AND BONDED PRODUCT USING SAME
Publication number
20200035637
Publication date
Jan 30, 2020
DOWA ELECTRONICS MATERIALS CO., LTD.
Tatsuro Hori
B22 - CASTING POWDER METALLURGY
Information
Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
Publication number
20190283129
Publication date
Sep 19, 2019
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi Endoh
B22 - CASTING POWDER METALLURGY
Information
Patent Application
JOINING MATERIAL AND JOINING METHOD USING SAME
Publication number
20190118257
Publication date
Apr 25, 2019
DOWA ELECTRONICS MATERIALS CO., LTD.
Satoru Kurita
B22 - CASTING POWDER METALLURGY
Information
Patent Application
METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET
Publication number
20180331063
Publication date
Nov 15, 2018
DOWA ELECTRONICS MATERIALS CO., LTD.
Satoru KURITA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
Publication number
20170252874
Publication date
Sep 7, 2017
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
Publication number
20170120395
Publication date
May 4, 2017
DOWA ELECTRONICS MATERIALS CO., LTD.
Satoru Kurita
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
Publication number
20170077057
Publication date
Mar 16, 2017
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR...
Publication number
20160254243
Publication date
Sep 1, 2016
DOWA ELECTRONICS MATERIALS CO., LTD.
Satoru KURITA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
Publication number
20160172328
Publication date
Jun 16, 2016
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi ENDOH
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
Publication number
20160136763
Publication date
May 19, 2016
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METAL PASTE FOR JOINING, JOINING METHOD AND JOINED BODY
Publication number
20160121435
Publication date
May 5, 2016
Toyota Jidosha Kabushiki Kaisha
Masashi FURUKAWA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METAL NANOPARTICLE DISPERSION, METHOD FOR PRODUCING METAL NANOPARTI...
Publication number
20160101486
Publication date
Apr 14, 2016
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi ENDOH
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
Publication number
20160099087
Publication date
Apr 7, 2016
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi ENDOH
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING MATERIAL AND BONDING METHOD IN WHICH SAID BONDING MATERIAL...
Publication number
20150028085
Publication date
Jan 29, 2015
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING MATERIAL AND BONDING BODY, AND BONDING METHOD
Publication number
20130323529
Publication date
Dec 5, 2013
DOWA ELECTRONICS MATERIALS CO., LTD.
Satoru Kurita
B32 - LAYERED PRODUCTS
Information
Patent Application
LOW-TEMPERATURE-SINTERABLE BONDING MATERIAL, AND BONDING METHOD USI...
Publication number
20130081759
Publication date
Apr 4, 2013
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi Endoh
B82 - NANO-TECHNOLOGY
Information
Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
Publication number
20120298009
Publication date
Nov 29, 2012
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING MATERIAL USING METAL NANOPARTICLES AND BONDING METHOD
Publication number
20120103515
Publication date
May 3, 2012
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR