Keiichi Endoh

Person

Okayama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding material and bonding method using same
- Patent number 12,048,964
- Issue date Jul 30, 2024
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Joining material and joining method using same
- Patent number 11,453,053
- Issue date Sep 27, 2022
- Dowa Electronics Materials Co., Ltd.
- Satoru Kurita
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,903,185
- Issue date Jan 26, 2021
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,821,558
- Issue date Nov 3, 2020
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,543,569
- Issue date Jan 28, 2020
- Dowa Electronics Materials Co., Ltd.
- Satoru Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,328,534
- Issue date Jun 25, 2019
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding method using bonding material
- Patent number 10,090,275
- Issue date Oct 2, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding method using the same
- Patent number 10,008,471
- Issue date Jun 26, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal nanoparticle dispersion, method for producing metal nanoparti...
- Patent number 9,662,748
- Issue date May 30, 2017
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding method in which said bonding material...
- Patent number 9,533,380
- Issue date Jan 3, 2017
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding body, and bonding method
- Patent number 9,486,879
- Issue date Nov 8, 2016
- Dowa Electronics Materials Co., Ltd.
- Satoru Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding method using the same
- Patent number 9,240,256
- Issue date Jan 19, 2016
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Bonding material using metal nanoparticles coated with C6-C8 fatty...
- Patent number 8,858,700
- Issue date Oct 14, 2014
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-temperature-sinterable bonding material, and bonding method usi...
- Patent number 8,641,929
- Issue date Feb 4, 2014
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METAL PASTE FOR BONDING AND BONDING METHOD
- Publication number 20230311249
- Publication date Oct 5, 2023
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi ENDOH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD EMPLOYING SAME
- Publication number 20200094318
- Publication date Mar 26, 2020
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Hideyuki FUJIMOTO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING MATERIAL AND BONDED PRODUCT USING SAME
- Publication number 20200035637
- Publication date Jan 30, 2020
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Tatsuro Hori
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20190283129
- Publication date Sep 19, 2019
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Application
JOINING MATERIAL AND JOINING METHOD USING SAME
- Publication number 20190118257
- Publication date Apr 25, 2019
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru Kurita
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET
- Publication number 20180331063
- Publication date Nov 15, 2018
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru KURITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20170252874
- Publication date Sep 7, 2017
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20170120395
- Publication date May 4, 2017
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20170077057
- Publication date Mar 16, 2017
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR...
- Publication number 20160254243
- Publication date Sep 1, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru KURITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
- Publication number 20160172328
- Publication date Jun 16, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi ENDOH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20160136763
- Publication date May 19, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PASTE FOR JOINING, JOINING METHOD AND JOINED BODY
- Publication number 20160121435
- Publication date May 5, 2016
- Toyota Jidosha Kabushiki Kaisha
- Masashi FURUKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL NANOPARTICLE DISPERSION, METHOD FOR PRODUCING METAL NANOPARTI...
- Publication number 20160101486
- Publication date Apr 14, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi ENDOH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
- Publication number 20160099087
- Publication date Apr 7, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi ENDOH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD IN WHICH SAID BONDING MATERIAL...
- Publication number 20150028085
- Publication date Jan 29, 2015
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING BODY, AND BONDING METHOD
- Publication number 20130323529
- Publication date Dec 5, 2013
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru Kurita
- B32 - LAYERED PRODUCTS
Information Patent Application
LOW-TEMPERATURE-SINTERABLE BONDING MATERIAL, AND BONDING METHOD USI...
- Publication number 20130081759
- Publication date Apr 4, 2013
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B82 - NANO-TECHNOLOGY
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
- Publication number 20120298009
- Publication date Nov 29, 2012
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL USING METAL NANOPARTICLES AND BONDING METHOD
- Publication number 20120103515
- Publication date May 3, 2012
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Keiichi Endoh

Person

Patents Grantslast 30 patents

Bonding material and bonding method using same

Joining material and joining method using same

Bonding material and bonding method using same

Bonding material and bonding method using same

Bonding material and bonding method using same

Bonding material and bonding method using same

Bonding method using bonding material

Bonding material and bonding method using the same

Metal nanoparticle dispersion, method for producing metal nanoparti...

Bonding material and bonding method in which said bonding material...

Bonding material and bonding body, and bonding method

Bonding material and bonding method using the same

Bonding material using metal nanoparticles coated with C6-C8 fatty...

Low-temperature-sinterable bonding material, and bonding method usi...

Patents Applicationslast 30 patents

METAL PASTE FOR BONDING AND BONDING METHOD

BONDING MATERIAL AND BONDING METHOD EMPLOYING SAME

BONDING MATERIAL AND BONDED PRODUCT USING SAME

BONDING MATERIAL AND BONDING METHOD USING SAME

JOINING MATERIAL AND JOINING METHOD USING SAME

METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET

BONDING MATERIAL AND BONDING METHOD USING SAME

BONDING MATERIAL AND BONDING METHOD USING SAME

BONDING MATERIAL AND BONDING METHOD USING SAME

JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR...

BONDING MATERIAL AND BONDING METHOD USING THE SAME

BONDING MATERIAL AND BONDING METHOD USING SAME

METAL PASTE FOR JOINING, JOINING METHOD AND JOINED BODY

METAL NANOPARTICLE DISPERSION, METHOD FOR PRODUCING METAL NANOPARTI...

BONDING MATERIAL AND BONDING METHOD USING THE SAME

BONDING MATERIAL AND BONDING METHOD IN WHICH SAID BONDING MATERIAL...

BONDING MATERIAL AND BONDING BODY, AND BONDING METHOD

LOW-TEMPERATURE-SINTERABLE BONDING MATERIAL, AND BONDING METHOD USI...

BONDING MATERIAL AND BONDING METHOD USING THE SAME

BONDING MATERIAL USING METAL NANOPARTICLES AND BONDING METHOD