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Keiichi Hashimoto
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Kanagawa, JP
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Patents Grants
last 30 patents
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Patent Grant
Sputtering cathode, sputtering device, and method for producing fil...
Patent number
10,692,708
Issue date
Jun 23, 2020
KEIHIN RAMTECH CO., LTD.
Hiroshi Iwata
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Chip-size-package semiconductor chip and manufacturing method
Patent number
8,119,453
Issue date
Feb 21, 2012
Lapis Semiconductor Co., Ltd.
Keiichi Hashimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming method of silicide film
Patent number
7,781,337
Issue date
Aug 24, 2010
Oki Semiconductor Co., Ltd.
Keiichi Hashimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory devices with charge traps
Patent number
7,602,012
Issue date
Oct 13, 2009
Oki Semiconductor Co., Ltd.
Keiichi Hashimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory and method of writing data into the semiconduc...
Patent number
7,554,833
Issue date
Jun 30, 2009
Oki Semiconductor Co., Ltd.
Keiichi Hashimoto
G11 - INFORMATION STORAGE
Patents Applications
last 30 patents
Information
Patent Application
Heat-Transfer Roller for Sputtering and Method of Making the Same
Publication number
20210050196
Publication date
Feb 18, 2021
KEIHIN RAMTECH CO., LTD.
Hiroshi IWATA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
HEAT-TRANSFER ROLLER FOR SPUTTERING AND METHOD OF MAKING THE SAME
Publication number
20200303173
Publication date
Sep 24, 2020
KEIHIN RAMTECH CO., LTD.
Hiroshi IWATA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Sputtering Cathode, Sputtering Device, and Method for Producing Fil...
Publication number
20190203346
Publication date
Jul 4, 2019
KEIHIN RAMTECH CO., LTD.
Hiroshi IWATA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SPUTTERING CATHODE, SPUTTERING DEVICE, AND METHOD FOR PRODUCING FIL...
Publication number
20180171464
Publication date
Jun 21, 2018
KEIHIN RAMTECH CO., LTD.
Hiroshi IWATA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Chip-size-package semiconductor chip and manufacturing method
Publication number
20100248425
Publication date
Sep 30, 2010
Oki Semiconductor Co., Ltd.
Keiichi Hashimoto
H01 - BASIC ELECTRIC ELEMENTS