Keiichi Hatakeyama

Person

Tsukuba, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive film for semiconductor, composite sheet, and method for pr...
- Patent number 8,404,564
- Issue date Mar 26, 2013
- Hitachi Chemical Company, Ltd.
- Yuuki Nakamura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing semiconductor chip, adhesive film for semi...
- Patent number 8,232,185
- Issue date Jul 31, 2012
- Hitachi Chemical Company, Ltd.
- Yuuki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing semiconductor chip with adhesive film, adhesiv...
- Patent number 8,198,176
- Issue date Jun 12, 2012
- Hitachi Chemical Company, Ltd.
- Keiichi Hatakeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, process for producing the same, adhesive film...
- Patent number 8,119,737
- Issue date Feb 21, 2012
- Hitachi Chemical Company, Ltd.
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for producing semiconductor chip with adhesive film, adhesiv...
- Patent number 8,071,465
- Issue date Dec 6, 2011
- Hitachi Chemical Company, Ltd.
- Keiichi Hatakeyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production method of semiconductor device and bonding film
- Patent number 8,034,659
- Issue date Oct 11, 2011
- Hitachi Chemical Company, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device by adhering circuit substrate with adhesive fi...
- Patent number 7,947,779
- Issue date May 24, 2011
- Hitachi Chemical Company, Ltd.
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing/die bonding sheet
- Patent number 7,517,724
- Issue date Apr 14, 2009
- Hitachi Chemical Company, Ltd.
- Keiichi Hatakeyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive composition, method for preparing the same, adhesive film...
- Patent number 7,070,670
- Issue date Jul 4, 2006
- Hitachi Chemical Co., Ltd.
- Takeo Tomiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20150179494
- Publication date Jun 25, 2015
- HITACHI CHEMICAL COMPANY, LTD.
- Takashi Kawamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20140332984
- Publication date Nov 13, 2014
- Teiichi Inada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...
- Publication number 20120295400
- Publication date Nov 22, 2012
- Keiichi Hatakeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, ADHESIVE FILM FOR SEMI...
- Publication number 20120244347
- Publication date Sep 27, 2012
- Yuuki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20120080808
- Publication date Apr 5, 2012
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...
- Publication number 20110318879
- Publication date Dec 29, 2011
- Keiichi HATAKEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIV...
- Publication number 20110193244
- Publication date Aug 11, 2011
- Takashi MASUKO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20110187006
- Publication date Aug 4, 2011
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20110021005
- Publication date Jan 27, 2011
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...
- Publication number 20100311227
- Publication date Dec 9, 2010
- Keiichi Hatakeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...
- Publication number 20100267199
- Publication date Oct 21, 2010
- Keiichi Hatakeyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, ADHESIVE FILM FOR SEMI...
- Publication number 20100120229
- Publication date May 13, 2010
- Yuuki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR, COMPOSITE SHEET, AND METHOD FOR PR...
- Publication number 20100112783
- Publication date May 6, 2010
- Yuuki Nakamura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRODUCTION METHOD OF SEMICONDUCTOR DEVICE AND BONDING FILM
- Publication number 20100003771
- Publication date Jan 7, 2010
- Hitachi Chemical Company, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...
- Publication number 20090186955
- Publication date Jul 23, 2009
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive film and process for preparing the same as well as adhesiv...
- Publication number 20070098995
- Publication date May 3, 2007
- HITACHI CHEMICAL CO., Ltd.
- Takashi Masuko
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive composition, process for producing the same, adhesive film...
- Publication number 20070036971
- Publication date Feb 15, 2007
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Dicing/die bonding sheet
- Publication number 20070026572
- Publication date Feb 1, 2007
- Keiichi Hatakeyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition, process for producing the same, adhesive film...
- Publication number 20060106166
- Publication date May 18, 2006
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition, process for producing the same, adhesive film...
- Publication number 20060100315
- Publication date May 11, 2006
- Teiichi Inada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition, method for preparing the same, adhesive film...
- Publication number 20030159773
- Publication date Aug 28, 2003
- Takeo Tomiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive composition , process for producing the same, adhesive fil...
- Publication number 20030069331
- Publication date Apr 10, 2003
- Inada Teiichi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Keiichi Hatakeyama

Person

Patents Grantslast 30 patents

Adhesive film for semiconductor, composite sheet, and method for pr...

Method for manufacturing semiconductor chip, adhesive film for semi...

Method for producing semiconductor chip with adhesive film, adhesiv...

Adhesive composition, process for producing the same, adhesive film...

Method for producing semiconductor chip with adhesive film, adhesiv...

Production method of semiconductor device and bonding film

Semiconductor device by adhering circuit substrate with adhesive fi...

Dicing/die bonding sheet

Adhesive composition, method for preparing the same, adhesive film...

Patents Applicationslast 30 patents

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, ADHESIVE FILM FOR SEMI...

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...

ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIV...

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, ADHESIVE FILM FOR SEMI...

ADHESIVE FILM FOR SEMICONDUCTOR, COMPOSITE SHEET, AND METHOD FOR PR...

PRODUCTION METHOD OF SEMICONDUCTOR DEVICE AND BONDING FILM

ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM...

Adhesive film and process for preparing the same as well as adhesiv...

Adhesive composition, process for producing the same, adhesive film...

Dicing/die bonding sheet

Adhesive composition, process for producing the same, adhesive film...

Adhesive composition, process for producing the same, adhesive film...

Adhesive composition, method for preparing the same, adhesive film...

Adhesive composition , process for producing the same, adhesive fil...