Keiichi Kimura

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ceramic laminate, ceramic insulating substrate, and method for manu...
- Patent number 10,889,899
- Issue date Jan 12, 2021
- Nippon Steel Corporation
- Keiichi Kimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ceramic laminate
- Patent number 10,889,900
- Issue date Jan 12, 2021
- Nippon Steel Corporation
- Keisuke Tokuhashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Oriented copper plate, copper-clad laminate, flexible circuit board...
- Patent number 9,883,588
- Issue date Jan 30, 2018
- Nippon Steel & Sumitomo Metal Corporation
- Keiichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal tape material and interconnector for solar module current col...
- Patent number 9,382,603
- Issue date Jul 5, 2016
- Nippon Steel & Sumitomo Metal Corporation
- Keiichi Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,112,059
- Issue date Aug 18, 2015
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board and method for producing same and bend struc...
- Patent number 9,060,432
- Issue date Jun 16, 2015
- Nippon Steel & Sumikin Chemical Co., Ltd.
- Koichi Hattori
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy bonding wire for semiconductor device
- Patent number 8,610,291
- Issue date Dec 17, 2013
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gold wire for semiconductor element connection
- Patent number 8,415,797
- Issue date Apr 9, 2013
- Nippon Steel & Sumikin Materials Co., Ltd.
- Keiichi Kimura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 8,389,860
- Issue date Mar 5, 2013
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 8,299,356
- Issue date Oct 30, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Wire bonding structure and method for forming same
- Patent number 8,247,911
- Issue date Aug 21, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding wire and wire bonding method
- Patent number 8,102,061
- Issue date Jan 24, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy bonding wire for semiconductor device
- Patent number 8,004,094
- Issue date Aug 23, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 7,952,028
- Issue date May 31, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gold wire for connecting semiconductor chip
- Patent number 7,830,008
- Issue date Nov 9, 2010
- Nippon Steel Materials Co., Ltd.
- Keiichi Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shoe press belt
- Patent number 6,929,718
- Issue date Aug 16, 2005
- Ichikawa Co., Ltd.
- Keiichi Kimura
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE
Information Patent Grant
Joining product of oxide superconducting material and process for p...
- Patent number 5,786,304
- Issue date Jul 28, 1998
- Nippon Steel Corporation
- Keiichi Kimura
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Oxide superconductor and process for preparation thereof
- Patent number 5,308,799
- Issue date May 3, 1994
- Nippon Steel Corporation
- Mitsuru Morita
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE STAINLESS STEEL FOIL AND FLEXIBLE LIGHT EMITTING DEVICE
- Publication number 20240150880
- Publication date May 9, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Keiichi KIMURA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
AUSTENITIC STAINLESS STEEL FOIL
- Publication number 20230407427
- Publication date Dec 21, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Mitsuharu YONEMURA
- C21 - METALLURGY OF IRON
Information Patent Application
COMPOSITE CERAMIC LAYERED BODY AND MANUFACTURING METHOD
- Publication number 20210101840
- Publication date Apr 8, 2021
- NIPPON STEEL CORPORATION
- Keiichi KIMURA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CERAMIC LAMINATE, CERAMIC INSULATING SUBSTRATE, AND METHOD FOR MAN...
- Publication number 20200071836
- Publication date Mar 5, 2020
- NIPPON STEEL & SUMITOMO METAL CORPORATION
- Keiichi KIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Differentiating Pluripotent Stem Cells
- Publication number 20190093082
- Publication date Mar 28, 2019
- Centre National De La Recherche Scientifique (CNRS)
- Eric Leclerc
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
CERAMIC LAMINATE
- Publication number 20190062923
- Publication date Feb 28, 2019
- NIPPON STEEL & SUMITOMO METAL CORPORATION
- Keisuke TOKUHASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ORIENTED COPPER PLATE, COPPER-CLAD LAMINATE, FLEXIBLE CIRCUIT BOARD...
- Publication number 20170332489
- Publication date Nov 16, 2017
- NIPPON STEEL & SUMITOMO METAL CORPORATION
- Keiichi KIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR PRODUCING SAME AND BEND STRUC...
- Publication number 20140254114
- Publication date Sep 11, 2014
- NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD.
- Koichi HATTORI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
INTERCONNECTOR FOR SOLAR CELLS, AND SOLAR CELL MODULE
- Publication number 20140109962
- Publication date Apr 24, 2014
- NIPPON STEEL & SUMITOMO METAL CORPORATION
- Takayuki Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL TAPE MATERIAL AND INTERCONNECTOR FOR SOLAR MODULE CURRENT COL...
- Publication number 20130008692
- Publication date Jan 10, 2013
- Keiichi Kimura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20120104613
- Publication date May 3, 2012
- NIPPON MICROMETAL CORPORATION
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20110011618
- Publication date Jan 20, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20110011619
- Publication date Jan 20, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD
- Publication number 20100327450
- Publication date Dec 30, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20100294532
- Publication date Nov 25, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20100282495
- Publication date Nov 11, 2010
- NIPPON STEEL MATERIALS CO., LTD
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURE OF BONDING WIRE AND METHOD FOR FORMING SAME
- Publication number 20100213619
- Publication date Aug 26, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GOLD WIRE FOR SEMICONDUCTOR ELEMENT CONNECTION
- Publication number 20090115059
- Publication date May 7, 2009
- Nippon Steel Materials Co., Ltd
- Keiichi Kimura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Gold Wire for Connecting Semiconductor Chip
- Publication number 20080105975
- Publication date May 8, 2008
- Keiichi Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20080061440
- Publication date Mar 13, 2008
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Shoe press mechanism of paper machine
- Publication number 20060266490
- Publication date Nov 30, 2006
- ICHIKAWA CO., LTD.
- Masataka Ushio
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE
Information Patent Application
Shoe press belt
- Publication number 20040065427
- Publication date Apr 8, 2004
- Ichikawa Co. Ltd.
- Keiichi Kimura
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE

Keiichi Kimura

Person

Patents Grantslast 30 patents

Ceramic laminate, ceramic insulating substrate, and method for manu...

Ceramic laminate

Oriented copper plate, copper-clad laminate, flexible circuit board...

Metal tape material and interconnector for solar module current col...

Bonding wire for semiconductor device

Flexible circuit board and method for producing same and bend struc...

Copper alloy bonding wire for semiconductor device

Gold wire for semiconductor element connection

Bonding wire for semiconductor devices

Bonding wire for semiconductor devices

Wire bonding structure and method for forming same

Semiconductor device bonding wire and wire bonding method

Copper alloy bonding wire for semiconductor device

Bonding wire for semiconductor device

Gold wire for connecting semiconductor chip

Shoe press belt

Joining product of oxide superconducting material and process for p...

Oxide superconductor and process for preparation thereof

Patents Applicationslast 30 patents

FLEXIBLE STAINLESS STEEL FOIL AND FLEXIBLE LIGHT EMITTING DEVICE

AUSTENITIC STAINLESS STEEL FOIL

COMPOSITE CERAMIC LAYERED BODY AND MANUFACTURING METHOD

CERAMIC LAMINATE, CERAMIC INSULATING SUBSTRATE, AND METHOD FOR MAN...

Method of Differentiating Pluripotent Stem Cells

CERAMIC LAMINATE

ORIENTED COPPER PLATE, COPPER-CLAD LAMINATE, FLEXIBLE CIRCUIT BOARD...

FLEXIBLE CIRCUIT BOARD AND METHOD FOR PRODUCING SAME AND BEND STRUC...

INTERCONNECTOR FOR SOLAR CELLS, AND SOLAR CELL MODULE

METAL TAPE MATERIAL AND INTERCONNECTOR FOR SOLAR MODULE CURRENT COL...

BONDING WIRE FOR SEMICONDUCTOR DEVICE

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING STRUCTURE OF BONDING WIRE AND METHOD FOR FORMING SAME

GOLD WIRE FOR SEMICONDUCTOR ELEMENT CONNECTION

Gold Wire for Connecting Semiconductor Chip

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

Shoe press mechanism of paper machine

Shoe press belt