Keiichi Naito

Person

Utsunomiya, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a bump-attached wiring circuit board
- Patent number 7,520,053
- Issue date Apr 21, 2009
- Sony Corporation
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a bump-attached wiring circuit board
- Patent number 7,020,961
- Issue date Apr 4, 2006
- Sony Corporation
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring circuit boards with bumps and metho...
- Patent number 6,977,349
- Issue date Dec 20, 2005
- Sony Corporation
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring circuit boards with bumps and metho...
- Patent number 6,562,250
- Issue date May 13, 2003
- Sony Chemicals Corporation
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump-attached wiring circuit board and method for manufacturing same
- Patent number 6,518,510
- Issue date Feb 11, 2003
- Sony Chemicals Corp.
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-flammable adhesive compositions
- Patent number 4,323,659
- Issue date Apr 6, 1982
- Sony Corporation
- Masanao Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of manufacturing an adhesive
- Patent number 4,158,725
- Issue date Jun 19, 1979
- Sony Corporation
- Makoto Nishimura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing a bump-attached wiring circuit board
- Publication number 20060070978
- Publication date Apr 6, 2006
- Sony Chemicals Corp.
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing wiring circuit boards with bumps and metho...
- Publication number 20030201242
- Publication date Oct 30, 2003
- Sony Chemicals Corporation
- Yutaka Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bump-attached wiring circuit board and method for manufacturing same
- Publication number 20030034173
- Publication date Feb 20, 2003
- SONY CHEMICALS CORP.
- Yutaka Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump-attached wiring circuit board and method for manufacturing same
- Publication number 20020005292
- Publication date Jan 17, 2002
- SONY CHEMICALS CORP.
- Yutaka Kaneda
- H01 - BASIC ELECTRIC ELEMENTS

Keiichi Naito

Person

Patents Grantslast 30 patents

Method for manufacturing a bump-attached wiring circuit board

Method for manufacturing a bump-attached wiring circuit board

Method for manufacturing wiring circuit boards with bumps and metho...

Method for manufacturing wiring circuit boards with bumps and metho...

Bump-attached wiring circuit board and method for manufacturing same

Non-flammable adhesive compositions

Method of manufacturing an adhesive

Patents Applicationslast 30 patents

Method for manufacturing a bump-attached wiring circuit board

Method for manufacturing wiring circuit boards with bumps and metho...

Bump-attached wiring circuit board and method for manufacturing same

Bump-attached wiring circuit board and method for manufacturing same