Keiichi Okabe

Person

Kosyoku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 9,093,498
- Issue date Jul 28, 2015
- Shin-Etsu Handotai Co., Ltd.
- Keiichi Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for evaluating semiconductor wafer, apparatus for evaluating...
- Patent number 7,810,383
- Issue date Oct 12, 2010
- Shin-Etsu Handotai Co., Ltd.
- Keiichi Okabe
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for manufacturing bonded wafer and outer-peripheral grinding...
- Patent number 7,727,860
- Issue date Jun 1, 2010
- Shin-Etsu Handotai Co., Ltd.
- Susumu Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production method for silicon wafer and SOI wafer, and SOI wafer
- Patent number 6,583,029
- Issue date Jun 24, 2003
- Shin-Etsu Handotai Co., Ltd.
- Takao Abe
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer and production method therefor
- Patent number 6,491,836
- Issue date Dec 10, 2002
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Processing method for a wafer
- Patent number 6,358,117
- Issue date Mar 19, 2002
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing process for semiconductor wafer
- Patent number 6,284,658
- Issue date Sep 4, 2001
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface grinding method and apparatus for thin plate work
- Patent number 6,220,928
- Issue date Apr 24, 2001
- Shin-Etsu Handotai Co., Ltd.
- Keiichi Okabe
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Method for Producing Bonded Wafer, Bonded Wafer, and Surface Grindi...
- Publication number 20090233109
- Publication date Sep 17, 2009
- SHIN-ETSU HANDOTAI CO., LDT.
- Keiichi Okabe
- B24 - GRINDING POLISHING
Information Patent Application
Method for manufacturing bonded wafer
- Publication number 20090111245
- Publication date Apr 30, 2009
- Shin-Etsu Handotai Co., Ltd.
- Keiichi Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing bonded wafer and outer-peripheral grinding...
- Publication number 20090042363
- Publication date Feb 12, 2009
- Shin-Etsu Handotai Co., Ltd.
- Susumu Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Evaluating Semiconductor Wafer, Apparatus for Evaluating...
- Publication number 20080166823
- Publication date Jul 10, 2008
- Keiichi Okabe
- G01 - MEASURING TESTING

Keiichi Okabe

Person

Patents Grantslast 30 patents

Method for manufacturing bonded wafer

Method for evaluating semiconductor wafer, apparatus for evaluating...

Method for manufacturing bonded wafer and outer-peripheral grinding...

Production method for silicon wafer and SOI wafer, and SOI wafer

Semiconductor wafer and production method therefor

Processing method for a wafer

Manufacturing process for semiconductor wafer

Surface grinding method and apparatus for thin plate work

Patents Applicationslast 30 patents

Method for Producing Bonded Wafer, Bonded Wafer, and Surface Grindi...

Method for manufacturing bonded wafer

Method for manufacturing bonded wafer and outer-peripheral grinding...

Method for Evaluating Semiconductor Wafer, Apparatus for Evaluating...