Keiichi Tanaka

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and systems to modulate film stress
- Patent number 11,887,818
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Tsutomu Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma induced modification of silicon carbide surface
- Patent number 11,692,267
- Issue date Jul 4, 2023
- Applied Materials, Inc.
- Francis Kanyiri Mungai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Susceptor wafer chucks for bowed wafers
- Patent number 11,581,213
- Issue date Feb 14, 2023
- Applied Materials, Inc.
- Abhishek Chowdhury
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In-situ film annealing with spatial atomic layer deposition
- Patent number 11,515,144
- Issue date Nov 29, 2022
- Applied Materials, Inc.
- Keiichi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-aligned double patterning with spatial atomic layer deposition
- Patent number 11,164,753
- Issue date Nov 2, 2021
- Applied Materials, Inc.
- Ning Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems to modulate film stress
- Patent number 11,158,489
- Issue date Oct 26, 2021
- Applied Materials, Inc.
- Tsutomu Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Geometrically selective deposition of dielectric films utilizing lo...
- Patent number 11,081,318
- Issue date Aug 3, 2021
- Applied Materials, Inc.
- Kenichi Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up gap-fill by surface poisoning treatment
- Patent number 11,028,477
- Issue date Jun 8, 2021
- Applied Materials, Inc.
- Mark Saly
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Spatial atomic layer deposition chamber with plasma pulsing to prev...
- Patent number 10,854,428
- Issue date Dec 1, 2020
- Applied Materials, Inc.
- Tsutomu Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING SUSCEPTOR POCKET EDGE FOR PROCESS IMPRO...
- Publication number 20240141492
- Publication date May 2, 2024
- Applied Materials, Inc.
- Prasanth Narayanan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ENHANCED CHAMBER CLEAN AND RECOVERY WITH DUAL FLOW PATH
- Publication number 20230307216
- Publication date Sep 28, 2023
- Applied Materials, Inc.
- Prasanth Narayanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA INDUCED MODIFICATION OF SILICON CARBIDE SURFACE
- Publication number 20220205095
- Publication date Jun 30, 2022
- Applied Materials, Inc.
- Francis Kanyiri Mungai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUSCEPTOR WAFER CHUCKS FOR BOWED WAFERS
- Publication number 20220093443
- Publication date Mar 24, 2022
- Applied Materials, Inc.
- Abhishek Chowdhury
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self-Aligned Double Patterning With Spatial Atomic Layer Deposition
- Publication number 20220059362
- Publication date Feb 24, 2022
- Applied Materials, Inc.
- Ning Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND SYSTEMS TO MODULATE FILM STRESS
- Publication number 20220028660
- Publication date Jan 27, 2022
- Applied Materials, Inc.
- Tsutomu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Geometrically Selective Deposition Of Dielectric Films Utilizing Lo...
- Publication number 20190189400
- Publication date Jun 20, 2019
- Applied Materials, Inc.
- Kenichi Ohno
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Spatial Atomic Layer Deposition Chamber With Plasma Pulsing To Prev...
- Publication number 20190180985
- Publication date Jun 13, 2019
- Applied Materials, Inc.
- Tsutomu Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods And Systems To Modulate Film Stress
- Publication number 20180130642
- Publication date May 10, 2018
- Applied Materials, Inc.
- Tsutomu Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
In-Situ Film Annealing With Spatial Atomic Layer Deposition
- Publication number 20170170009
- Publication date Jun 15, 2017
- Applied Materials, Inc.
- Keiichi Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Bottom-Up Gap-Fill by Surface Poisoning Treatment
- Publication number 20170114459
- Publication date Apr 27, 2017
- Applied Materials, Inc.
- Mark Saly
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma Module With Slotted Ground Plate
- Publication number 20170076917
- Publication date Mar 16, 2017
- Applied Materials, Inc.
- Joseph Yudovsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEAMLESS GAP-FILL WITH SPATIAL ATOMIC LAYER DEPOSITION
- Publication number 20150255324
- Publication date Sep 10, 2015
- Applied Materials, Inc.
- Ning LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Double Patterning With Spatial Atomic Layer Deposition
- Publication number 20150200110
- Publication date Jul 16, 2015
- Applied Materials, Inc.
- Ning Li
- H01 - BASIC ELECTRIC ELEMENTS

Keiichi Tanaka

Person

Patents Grantslast 30 patents

Methods and systems to modulate film stress

Plasma induced modification of silicon carbide surface

Susceptor wafer chucks for bowed wafers

In-situ film annealing with spatial atomic layer deposition

Self-aligned double patterning with spatial atomic layer deposition

Methods and systems to modulate film stress

Geometrically selective deposition of dielectric films utilizing lo...

Bottom-up gap-fill by surface poisoning treatment

Spatial atomic layer deposition chamber with plasma pulsing to prev...

Patents Applicationslast 30 patents

SEMICONDUCTOR MANUFACTURING SUSCEPTOR POCKET EDGE FOR PROCESS IMPRO...

ENHANCED CHAMBER CLEAN AND RECOVERY WITH DUAL FLOW PATH

PLASMA INDUCED MODIFICATION OF SILICON CARBIDE SURFACE

SUSCEPTOR WAFER CHUCKS FOR BOWED WAFERS

Self-Aligned Double Patterning With Spatial Atomic Layer Deposition

METHODS AND SYSTEMS TO MODULATE FILM STRESS

Geometrically Selective Deposition Of Dielectric Films Utilizing Lo...

Spatial Atomic Layer Deposition Chamber With Plasma Pulsing To Prev...

Methods And Systems To Modulate Film Stress

In-Situ Film Annealing With Spatial Atomic Layer Deposition

Bottom-Up Gap-Fill by Surface Poisoning Treatment

Plasma Module With Slotted Ground Plate

SEAMLESS GAP-FILL WITH SPATIAL ATOMIC LAYER DEPOSITION

Self-Aligned Double Patterning With Spatial Atomic Layer Deposition