Keiichiro Kata

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate for mounting semiconductors, method of manufacturi...
- Patent number 8,198,140
- Issue date Jun 12, 2012
- NEC Corporation
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate for mounting semiconductors, method of manufacturi...
- Patent number 7,816,782
- Issue date Oct 19, 2010
- NEC Corporation
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and semiconductor package using the same
- Patent number 7,566,834
- Issue date Jul 28, 2009
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and semiconductor package using the same
- Patent number 7,397,000
- Issue date Jul 8, 2008
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate, and method of producing same
- Patent number 7,233,066
- Issue date Jun 19, 2007
- NEC Electronics Corporation
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing semiconductor device and semiconductor wafer
- Patent number RE39603
- Issue date May 1, 2007
- NEC Corporation
- Keiichiro Kata
- 257 - Active solid-state devices
Information Patent Grant
Multilayer wiring substrate, and method of producing same
- Patent number 7,060,604
- Issue date Jun 13, 2006
- NGK Spark Plug Co., Ltd.
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for inspecting semiconductor chip bonding pads using infrare...
- Patent number 6,339,337
- Issue date Jan 15, 2002
- NEC Corporation
- Shuichi Matsuda
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device using wiring tape
- Patent number 6,201,298
- Issue date Mar 13, 2001
- NEC Corporation
- Ryoji Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape automated bonding film
- Patent number 6,114,754
- Issue date Sep 5, 2000
- NEC Corporation
- Keiichiro Kata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multilayer film carrier
- Patent number 5,977,617
- Issue date Nov 2, 1999
- NEC Corporation
- Keiichiro Kata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bump leaded film carrier type semiconducto...
- Patent number 5,905,303
- Issue date May 18, 1999
- NEC Corporation
- Keiichiro Kata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for adhesively bonding a semiconductor chip to a carrier film
- Patent number 5,897,337
- Issue date Apr 27, 1999
- NEC Corporation
- Keiichiro Kata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing semiconductor device and semiconductor wafer
- Patent number 5,844,304
- Issue date Dec 1, 1998
- NEC Corporation
- Keiichiro Kata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip-size package-type semiconductor device
- Patent number 5,759,873
- Issue date Jun 2, 1998
- NEC Corporation
- Keiichiro Kata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier film with peripheral slits
- Patent number 5,757,068
- Issue date May 26, 1998
- NEC Corporation
- Keiichiro Kata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film carrier semiconductor device
- Patent number 5,726,489
- Issue date Mar 10, 1998
- NEC Corporation
- Shuichi Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bump leaded film carrier type semiconducto...
- Patent number 5,683,942
- Issue date Nov 4, 1997
- NEC Corporation
- Keiichiro Kata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate having wiring of silver series
- Patent number 5,292,574
- Issue date Mar 8, 1994
- NEC Corporation
- Keiichiro Kata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a ceramic wiring substrate having a low d...
- Patent number 5,283,081
- Issue date Feb 1, 1994
- NEC Corporation
- Keiichiro Kata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature sintering low dielectric inorganic composition
- Patent number 5,283,210
- Issue date Feb 1, 1994
- NEC Corporation
- Keiichiro Kata
- C03 - GLASS MINERAL OR SLAG WOOL

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE FOR MOUNTING SEMICONDUCTORS, METHOD OF MANUFACTURI...
- Publication number 20110003472
- Publication date Jan 6, 2011
- NEC Corporation
- Hideya MURAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME
- Publication number 20080258283
- Publication date Oct 23, 2008
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring substrate, and method of producing same
- Publication number 20060189125
- Publication date Aug 24, 2006
- NGK SPARK PLUG CO., LTD.
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate for mounting semiconductors, method of manufacturi...
- Publication number 20060012048
- Publication date Jan 19, 2006
- NEC CORPORATION AND NEC ELECTRONICS CORPORATION
- Hideya Murai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board and semiconductor package using the same
- Publication number 20050252682
- Publication date Nov 17, 2005
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board, semiconductor package, base insulating film,...
- Publication number 20040089470
- Publication date May 13, 2004
- NEC Corporation
- Tadanori Shimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring substrate, and method of producing same
- Publication number 20040053489
- Publication date Mar 18, 2004
- NGK SPARK PLUG CO., LTD.
- Keiichiro Kata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Keiichiro Kata

Person

Patents Grantslast 30 patents

Wiring substrate for mounting semiconductors, method of manufacturi...

Wiring substrate for mounting semiconductors, method of manufacturi...

Wiring board and semiconductor package using the same

Wiring board and semiconductor package using the same

Multilayer wiring substrate, and method of producing same

Process for manufacturing semiconductor device and semiconductor wafer

Multilayer wiring substrate, and method of producing same

Method for inspecting semiconductor chip bonding pads using infrare...

Semiconductor device using wiring tape

Tape automated bonding film

Semiconductor device having multilayer film carrier

Method for manufacturing bump leaded film carrier type semiconducto...

Process for adhesively bonding a semiconductor chip to a carrier film

Process for manufacturing semiconductor device and semiconductor wafer

Method of manufacturing chip-size package-type semiconductor device

Carrier film with peripheral slits

Film carrier semiconductor device

Method for manufacturing bump leaded film carrier type semiconducto...

Ceramic substrate having wiring of silver series

Process for manufacturing a ceramic wiring substrate having a low d...

Low temperature sintering low dielectric inorganic composition

Patents Applicationslast 30 patents

WIRING SUBSTRATE FOR MOUNTING SEMICONDUCTORS, METHOD OF MANUFACTURI...

WIRING BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME

Multilayer wiring substrate, and method of producing same

Wiring substrate for mounting semiconductors, method of manufacturi...

Wiring board and semiconductor package using the same

Printed circuit board, semiconductor package, base insulating film,...

Multilayer wiring substrate, and method of producing same