Keiichiro Tsutsumi

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Room temperature bonding apparatus and room temperature bonding method
- Patent number 9,580,306
- Issue date Feb 28, 2017
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Masato Kinouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ROOM-TEMPERATURE BONDED DEVICE, WAFER HAVING ROOM-TEMPERATURE BONDE...
- Publication number 20150294900
- Publication date Oct 15, 2015
- Mitsubishi Heavy Industries, Ltd.
- Takayuki Goto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD
- Publication number 20150251904
- Publication date Sep 10, 2015
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING METHOD, BONDING APPARATUS, AND BONDING SYSTEM
- Publication number 20120247645
- Publication date Oct 4, 2012
- MITSUBISHI HEAVY INDUSTIRIES, LTD.
- Keiichiro Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS