Keiji Arai

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board manufacturing method
- Patent number 7,935,891
- Issue date May 3, 2011
- Fujitsu Limited
- Takashi Shuto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board manufacturing method
- Patent number 7,377,030
- Issue date May 27, 2008
- Fujitsu Limited
- Takashi Shuto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board and method of making the same
- Patent number 6,531,661
- Issue date Mar 11, 2003
- Fujitsu Limited
- Katsumi Uchikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing line for multi-layered printed circuit boards
- Patent number 6,021,833
- Issue date Feb 8, 2000
- Fujitsu Limited
- Katsumi Uchikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for copper plating a wiring board
- Patent number 5,538,616
- Issue date Jul 23, 1996
- Fujitsu Limited
- Keiji Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper plating process and wiring board
- Patent number 5,448,021
- Issue date Sep 5, 1995
- Fujitsu Limited
- Keiji Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Wiring board manufacturing method
- Publication number 20080142256
- Publication date Jun 19, 2008
- FUJITSU LIMITED
- Takashi Shuto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board manufacturing method
- Publication number 20060112544
- Publication date Jun 1, 2006
- FUJITSU LIMITED
- Takashi Shuto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer printed circuit board and method of making the same
- Publication number 20020108776
- Publication date Aug 15, 2002
- FUJITSU LIMITED
- Katsumi Uchikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR