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Keiji Hashimoto
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Tokyo, JP
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last 30 patents
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Patent Grant
Method of manufacturing interconnecting structure with vias
Patent number
7,605,085
Issue date
Oct 20, 2009
Renesas Technology Corp.
Kazuo Tomita
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE WITH AT LEAST ONE AIR GAP PROVIDED IN CHIP OUT...
Publication number
20090121313
Publication date
May 14, 2009
RENESAS TECHNOLOGY CORP.
Keiji HASHIMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING INTERCONNECTING STRUCTURE WITH VIAS
Publication number
20070007658
Publication date
Jan 11, 2007
Renesas Technology Corp.
Kazuo Tomita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic device and its manufacturing method
Publication number
20060163730
Publication date
Jul 27, 2006
Susumu Matsumoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnecting structure with dummy vias
Publication number
20050035457
Publication date
Feb 17, 2005
Renesas Technology Corp.
Kazuo Tomita
H01 - BASIC ELECTRIC ELEMENTS