Keiji Maeda

Person

Kyoto-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Low-adhesion material, resin molding die, and soil resistant material
- Patent number 7,901,797
- Issue date Mar 8, 2011
- Towa Corporation
- Takaki Kuno
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Low-adhesion material, mold for molding resin using the same and co...
- Patent number 7,784,764
- Issue date Aug 31, 2010
- Towa Corporation
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Conductive porous material, resin molding die employing the same, a...
- Patent number 7,732,037
- Issue date Jun 8, 2010
- Towa Corporation
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of evaluating adhesion property, low-adhesion material, and...
- Patent number 7,614,293
- Issue date Nov 10, 2009
- Towa Corporation
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Composite material and resin mold
- Patent number 7,407,146
- Issue date Aug 5, 2008
- Towa Corporation
- Takaki Kuno
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin mold material and resin mold
- Patent number 7,287,975
- Issue date Oct 30, 2007
- Towa Corporation
- Kazuhiko Bandoh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Die used for resin-sealing and molding an electronic component
- Patent number 6,773,247
- Issue date Aug 10, 2004
- Towa Corporation
- Michio Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of coating semiconductor wafer with resin and mold used ther...
- Patent number 6,346,433
- Issue date Feb 12, 2002
- Towa Corporation
- Keiji Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing and molding apparatus for sealing electronic parts
- Patent number 5,783,220
- Issue date Jul 21, 1998
- Towa Corporation
- Michio Osada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin sealing/molding apparatus for electronic parts
- Patent number 5,750,154
- Issue date May 12, 1998
- Towa Corporation
- Keiji Maeda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
MAINTENANCE METHOD
- Publication number 20250016294
- Publication date Jan 9, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Shinji KAWASAKI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND...
- Publication number 20120076886
- Publication date Mar 29, 2012
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
COMPRESSION RESIN SEALING AND MOLDING METHOD FOR ELECTRONIC COMPONE...
- Publication number 20110233821
- Publication date Sep 29, 2011
- TOWA CORPORATION
- Kazuhiko Bandoh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND...
- Publication number 20110042857
- Publication date Feb 24, 2011
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND...
- Publication number 20100012816
- Publication date Jan 21, 2010
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Low-Adhesion Material, Resin Molding Die, and Soil Resistant Material
- Publication number 20090107361
- Publication date Apr 30, 2009
- TOWA CORPORATION
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Low Adhesion Material, Resin Molding Die, and Soil Resistant Material
- Publication number 20080296532
- Publication date Dec 4, 2008
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of Evaluating Adhesion Property, Low-Adhesion Material, and...
- Publication number 20080254286
- Publication date Oct 16, 2008
- TOWA CORPORATION
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of resin-seal-molding electronic component and apparatus the...
- Publication number 20070072346
- Publication date Mar 29, 2007
- TOWA CORPORATION
- Keiji Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of resin-seal-molding electronic component and apparatus the...
- Publication number 20070069421
- Publication date Mar 29, 2007
- TOWA CORPORATION
- Keiji Maeda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Conductive porous material, resin molding die employing the same, a...
- Publication number 20060286346
- Publication date Dec 21, 2006
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin casting mold and method of casting resin
- Publication number 20060131780
- Publication date Jun 22, 2006
- TOWA CORPORATION
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Low-adhesion material and mold for molding resin using the same
- Publication number 20060093693
- Publication date May 4, 2006
- TOWO CORPORATION JAPAN FINE CERAMICS CENTER
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Composite material and resin mold
- Publication number 20050154113
- Publication date Jul 14, 2005
- TOWA CORPORATION
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin mold material and resin mold
- Publication number 20040253334
- Publication date Dec 16, 2004
- TOWA CORPORATION
- Kazuhiko Bandoh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Keiji Maeda

Person

Patents Grantslast 30 patents

Low-adhesion material, resin molding die, and soil resistant material

Low-adhesion material, mold for molding resin using the same and co...

Conductive porous material, resin molding die employing the same, a...

Method of evaluating adhesion property, low-adhesion material, and...

Composite material and resin mold

Resin mold material and resin mold

Die used for resin-sealing and molding an electronic component

Method of coating semiconductor wafer with resin and mold used ther...

Resin sealing and molding apparatus for sealing electronic parts

Resin sealing/molding apparatus for electronic parts

Patents Applicationslast 30 patents

MAINTENANCE METHOD

METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND...

COMPRESSION RESIN SEALING AND MOLDING METHOD FOR ELECTRONIC COMPONE...

METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND...

METHOD OF EVALUATING ADHESION PROPERTY, LOW-ADHESION MATERIAL, AND...

Low-Adhesion Material, Resin Molding Die, and Soil Resistant Material

Low Adhesion Material, Resin Molding Die, and Soil Resistant Material

Method of Evaluating Adhesion Property, Low-Adhesion Material, and...

Method of resin-seal-molding electronic component and apparatus the...

Method of resin-seal-molding electronic component and apparatus the...

Conductive porous material, resin molding die employing the same, a...

Resin casting mold and method of casting resin

Low-adhesion material and mold for molding resin using the same

Composite material and resin mold

Resin mold material and resin mold