Keiji OHORI

Person

Saitama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating (LED) dice using semiconductor structures on...
- Patent number 11,862,754
- Issue date Jan 2, 2024
- SemiLEDs Corporation
- Chen-Fu Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating (LED) dice using laser lift-off from a subst...
- Patent number 11,862,755
- Issue date Jan 2, 2024
- Shin-Etsu Chemical Co., Ltd.
- Chen-Fu Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating (LED) dice using laser lift-off from a subst...
- Patent number 11,417,799
- Issue date Aug 16, 2022
- SemiLEDs Corporation
- Chen-Fu Chu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method For Fabricating (LED) Dice Using Laser Lift-Off From A Subst...
- Publication number 20240072203
- Publication date Feb 29, 2024
- SemiLEDs Corporation
- Chen-Fu Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Fabricating (LED) Dice Using Laser Lift-Off From A Subst...
- Publication number 20230018855
- Publication date Jan 19, 2023
- SemiLEDs Corporation
- CHEN-FU CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Fabricating (LED) Dice Using Laser Lift-Off From A Subst...
- Publication number 20220359785
- Publication date Nov 10, 2022
- SemiLEDs Corporation
- Chen-Fu Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING MICROSTRUCTURES, AND METHOD FOR MOUNTING MI...
- Publication number 20220315418
- Publication date Oct 6, 2022
- Shin-Etsu Chemical Co., Ltd.
- Yoshinori OGAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method For Fabricating (LED) Dice Using Semiconductor Structures On...
- Publication number 20220271198
- Publication date Aug 25, 2022
- SemiLEDs Corporation
- Chen-Fu Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROSTRUCTURE-TRANSFER APPARATUS, STAMP HEAD UNIT, STAMP COMPONENT...
- Publication number 20220124949
- Publication date Apr 21, 2022
- Shin-Etsu Chemical Co., Ltd.
- Hideo NAKAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Fabricating (LED) Dice Using Laser Lift-Off From A Subst...
- Publication number 20210066541
- Publication date Mar 4, 2021
- SemiLEDs Corporation
- Chen-Fu Chu
- H01 - BASIC ELECTRIC ELEMENTS

Keiji OHORI

Person

Patents Grantslast 30 patents

Method for fabricating (LED) dice using semiconductor structures on...

Method for fabricating (LED) dice using laser lift-off from a subst...

Method for fabricating (LED) dice using laser lift-off from a subst...

Patents Applicationslast 30 patents

Method For Fabricating (LED) Dice Using Laser Lift-Off From A Subst...

Method For Fabricating (LED) Dice Using Laser Lift-Off From A Subst...

Method For Fabricating (LED) Dice Using Laser Lift-Off From A Subst...

METHOD FOR TRANSFERRING MICROSTRUCTURES, AND METHOD FOR MOUNTING MI...

Method For Fabricating (LED) Dice Using Semiconductor Structures On...

MICROSTRUCTURE-TRANSFER APPARATUS, STAMP HEAD UNIT, STAMP COMPONENT...

Method For Fabricating (LED) Dice Using Laser Lift-Off From A Subst...