Keiko ASHIDA

Follow

Person

Amagasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Heat-resistant insulated wire and electrodeposition liquid used to...
- Patent number 10,395,798
- Issue date Aug 27, 2019
- Mitsubishi Materials Corporation
- Shintaro Iida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY CONDUCTIVE POLYMER COMPOSITION, MATERIAL FOR FORMING THER...
- Publication number 20250223439
- Publication date Jul 10, 2025
- MITSUBISHI MATERIALS CORPORATION
- Yuu Nakahara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMALLY CONDUCTIVE POLYMER COMPOSITION, MATERIAL FOR FORMING THER...
- Publication number 20250197554
- Publication date Jun 19, 2025
- MITSUBISHI MATERIALS CORPORATION
- Shintaro Iida
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOPLASTIC ELASTOMER COMPOSITION, THERMALLY CONDUCTIVE SHEET, AN...
- Publication number 20250179283
- Publication date Jun 5, 2025
- MITSUBISHI MATERIALS CORPORATION
- Keiko Ashida
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN MOLDED BODY, BATTERY PACK
- Publication number 20240047819
- Publication date Feb 8, 2024
- MITSUBISHI MATERIALS CORPORATION
- Mariko Wakamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-RESISTANT INSULATED WIRE AND ELECTRODEPOSITION LIQUID USED TO...
- Publication number 20180366241
- Publication date Dec 20, 2018
- MITSUBISHI MATERIALS CORPORATION
- Shintaro IIDA
- H01 - BASIC ELECTRIC ELEMENTS