Keiko Isoda

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin-encapsulated semiconductor apparatus and process for its fabr...
- Patent number 7,521,744
- Issue date Apr 21, 2009
- Renesas Technology Corp.
- Jun Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin-encapsulated semiconductor apparatus and process for its fabr...
- Patent number 7,064,368
- Issue date Jun 20, 2006
- Renesas Technology Corp.
- Jun Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin-encapsulated semiconductor apparatus and process for its fabr...
- Patent number 6,847,125
- Issue date Jan 25, 2005
- Renesas Technology Corp.
- Jun Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin-encapsulated semiconductor apparatus and process for its fabr...
- Patent number 6,657,245
- Issue date Dec 2, 2003
- Hitachi, Ltd.
- Jun Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin-encapsulated semiconductor apparatus and process for its fabr...
- Patent number 6,617,630
- Issue date Sep 9, 2003
- Hitachi, Ltd.
- Jun Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin-encapsulated semiconductor apparatus and process for its fabr...
- Patent number 6,525,359
- Issue date Feb 25, 2003
- Hitachi, Ltd.
- Jun Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin-encapsulated semiconductor apparatus and process for its fabr...
- Patent number 6,465,827
- Issue date Oct 15, 2002
- Hitachi, Ltd.
- Jun Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin-encapsulated semiconductor apparatus and process for its fabr...
- Patent number 6,441,416
- Issue date Aug 27, 2002
- Hitachi, Ltd.
- Jun Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive polyimide precursor and its use for pattern formation
- Patent number 6,319,656
- Issue date Nov 20, 2001
- Hitachi Chemical Company, Ltd.
- Haruhiko Kikkawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Surface-protecting film and resin-sealed semiconductor device havin...
- Patent number 6,200,831
- Issue date Mar 13, 2001
- Hitachi, Ltd.
- Jun Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin-encapsulated semiconductor apparatus
- Patent number 6,147,374
- Issue date Nov 14, 2000
- Hitachi, Ltd.
- Jun Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Surface-protecting film and resin-sealed semiconductor device havin...
- Patent number 6,087,006
- Issue date Jul 11, 2000
- Hitachi, Ltd.
- Jun Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitve polymide precursor and its use for pattern formation
- Patent number 6,025,113
- Issue date Feb 15, 2000
- Hitachi Chemical Company, Ltd.
- Haruhiko Kikkawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Resin-encapsulated semiconductor apparatus and process for its fabr...
- Publication number 20050248014
- Publication date Nov 10, 2005
- RENESAS TECHNOLOGY CORP.
- Jun Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin-encapsulated semiconductor apparatus and process for its fabr...
- Publication number 20050046047
- Publication date Mar 3, 2005
- Hitachi, Ltd.
- Jun Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin-encapsulated semiconductor apparatus and process for its fabr...
- Publication number 20040084785
- Publication date May 6, 2004
- Hitachi, Ltd.
- Jun Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin-encapsulated semiconductor apparatus and process for its fabr...
- Publication number 20020195724
- Publication date Dec 26, 2002
- Hitachi, Ltd.
- Jun Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-encapsulated semiconductor apparatus and process for its fabr...
- Publication number 20020195725
- Publication date Dec 26, 2002
- Jun Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-encapsulated semiconductor apparatus and process for its fabr...
- Publication number 20020060373
- Publication date May 23, 2002
- Hitachi, Ltd.
- Jun Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photosensitive polyimide precursor and its use for pattern formation
- Publication number 20020048726
- Publication date Apr 25, 2002
- Hitachi Chemical Company, Ltd.
- Haruhiko Kikkawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin-encapsulated semiconductor apparatus and process for its fabr...
- Publication number 20020027268
- Publication date Mar 7, 2002
- Hitachi, Ltd.
- Jun Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Keiko Isoda

Person

Patents Grantslast 30 patents

Resin-encapsulated semiconductor apparatus and process for its fabr...

Resin-encapsulated semiconductor apparatus and process for its fabr...

Resin-encapsulated semiconductor apparatus and process for its fabr...

Resin-encapsulated semiconductor apparatus and process for its fabr...

Resin-encapsulated semiconductor apparatus and process for its fabr...

Resin-encapsulated semiconductor apparatus and process for its fabr...

Resin-encapsulated semiconductor apparatus and process for its fabr...

Resin-encapsulated semiconductor apparatus and process for its fabr...

Photosensitive polyimide precursor and its use for pattern formation

Surface-protecting film and resin-sealed semiconductor device havin...

Resin-encapsulated semiconductor apparatus

Surface-protecting film and resin-sealed semiconductor device havin...

Photosensitve polymide precursor and its use for pattern formation

Patents Applicationslast 30 patents

Resin-encapsulated semiconductor apparatus and process for its fabr...

Resin-encapsulated semiconductor apparatus and process for its fabr...

Resin-encapsulated semiconductor apparatus and process for its fabr...

Resin-encapsulated semiconductor apparatus and process for its fabr...

Resin-encapsulated semiconductor apparatus and process for its fabr...

Resin-encapsulated semiconductor apparatus and process for its fabr...

Photosensitive polyimide precursor and its use for pattern formation

Resin-encapsulated semiconductor apparatus and process for its fabr...