Keiko SEKIYA

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Ichihara-shi, Chiba, JP

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Patents Applicationslast 30 patents

Information Patent Application
STRETCHED FILM, LAMINATE, AND PACKAGE
- Publication number 20240052117
- Publication date Feb 15, 2024
- Prime Polymer Co., Ltd.
- Keiko SEKIYA
- B32 - LAYERED PRODUCTS
Information Patent Application
ETHYLENE RESIN COMPOSITION AND FILM
- Publication number 20230119372
- Publication date Apr 20, 2023
- Prime Polymer Co., Ltd.
- Keiko SEKIYA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LAMINATES AND LIQUID PACKAGING BAGS
- Publication number 20210039364
- Publication date Feb 11, 2021
- Prime Polymer Co., Ltd.
- Sumiaki FUJII
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION FOR SEALANT, MULTILAYER FILM FOR SEALANT, HEAT-FU...
- Publication number 20210009794
- Publication date Jan 14, 2021
- Prime Polymer Co., Ltd.
- Keiko SEKIYA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LAMINATE, CONTAINER AND MANUFACTURING METHOD THEREOF, AND SHEET FOR...
- Publication number 20170341354
- Publication date Nov 30, 2017
- Prime Polymer Co., Ltd.
- Keiko SEKIYA
- B32 - LAYERED PRODUCTS