Keiko UENO

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Chiyoda-ku, Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive composition and semiconductor device production method
- Patent number 11,795,356
- Issue date Oct 24, 2023
- Kazutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE FOR SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE AND METHOD FO...
- Publication number 20230352436
- Publication date Nov 2, 2023
- Resonac Corporation
- Toshiyasu AKIYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
- Publication number 20210309897
- Publication date Oct 7, 2021
- Showa Denko Materials Co., Ltd.
- Kazutaka HONDA
- H01 - BASIC ELECTRIC ELEMENTS