Keishi Okamoto

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Controlling of height of high-density interconnection structure on...
- Patent number 12,087,596
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Keishi Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of bridging between solder joints
- Patent number 11,456,269
- Issue date Sep 27, 2022
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection with side connection to substrate
- Patent number 11,264,314
- Issue date Mar 1, 2022
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling of height of high-density interconnection structure on...
- Patent number 11,114,308
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Keishi Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of bridging between solder joints
- Patent number 11,004,819
- Issue date May 11, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of a sacrificial interposer test structure
- Patent number 10,643,910
- Issue date May 5, 2020
- International Business Machines Corporation
- Hiroyuki Mori
- G01 - MEASURING TESTING
Information Patent Grant
High-density interconnecting adhesive tape
- Patent number 10,622,311
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing warpage of an organic substrate
- Patent number 10,595,399
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Sayuri Hada
- G01 - MEASURING TESTING
Information Patent Grant
High-density interconnecting adhesive tape
- Patent number 10,529,665
- Issue date Jan 7, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip mounting structure
- Patent number 10,141,278
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of sacrificial interposer test structure
- Patent number 10,109,540
- Issue date Oct 23, 2018
- International Business Machines Corporation
- Hiroyuki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communication device with joined semiconductors
- Patent number 10,090,586
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing warpage of an orgacnic substrate
- Patent number 9,967,971
- Issue date May 8, 2018
- International Business Machines Corporation
- Sayuri Hada
- G01 - MEASURING TESTING
Information Patent Grant
Electrical connecting structure between a substrate and a semicondu...
- Patent number 9,941,230
- Issue date Apr 10, 2018
- International Business Machines Corporation
- Keiji Matsumoto
- G02 - OPTICS
Information Patent Grant
Chip mounting structure
- Patent number 9,893,031
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Akihiro Horibe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless communication device with joined semiconductors
- Patent number 9,780,442
- Issue date Oct 3, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for electrical contact passing through layers of optical wavegu...
- Patent number 9,772,462
- Issue date Sep 26, 2017
- International Business Machines Corporation
- Hirokazu Noma
- G02 - OPTICS
Information Patent Grant
Circuit board formation using organic substrates
- Patent number 9,760,002
- Issue date Sep 12, 2017
- International Business Machines Corporation
- Hiroyuki Mori
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Circuit board formation using organic substrates
- Patent number 9,684,237
- Issue date Jun 20, 2017
- International Business Machines Corporation
- Hiroyuki Mori
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Via for electrical contact passing through layers of optical wavegu...
- Patent number 9,354,408
- Issue date May 31, 2016
- International Business Machines Corporation
- Hirokazu Noma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package for millimeter wave semiconductor dies
- Patent number 9,219,041
- Issue date Dec 22, 2015
- International Business Machines Corporation
- Danny Elad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency transition matching in an electronic package for mil...
- Patent number 8,912,634
- Issue date Dec 16, 2014
- International Business Machines Corporation
- Elad Danny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip incorporating embedded thermal radiators fo...
- Patent number 8,756,549
- Issue date Jun 17, 2014
- International Business Machines Corporation
- Richard S. Graf
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
CONTROLLING OF HEIGHT OF HIGH-DENSITY INTERCONNECTION STRUCTURE ON...
- Publication number 20210343545
- Publication date Nov 4, 2021
- International Business Machines Corporation
- Keishi Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS
- Publication number 20210210454
- Publication date Jul 8, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION WITH SIDE CONNECTION TO SUBSTRATE
- Publication number 20210098349
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS
- Publication number 20210098404
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Risa Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING OF HEIGHT OF HIGH-DENSITY INTERCONNECTION STRUCTURE ON...
- Publication number 20200098592
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Keishi Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING WARPAGE OF AN ORGANIC SUBSTRATE
- Publication number 20190053370
- Publication date Feb 14, 2019
- International Business Machines Corporation
- Sayuri Hada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-DENSITY INTERCONNECTING ADHESIVE TAPE
- Publication number 20190051603
- Publication date Feb 14, 2019
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY INTERCONNECTING ADHESIVE TAPE
- Publication number 20190051605
- Publication date Feb 14, 2019
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF A SACRIFICIAL INTERPOSER TEST STRUCTURE
- Publication number 20190006250
- Publication date Jan 3, 2019
- International Business Machines Corporation
- Hiroyuki Mori
- G01 - MEASURING TESTING
Information Patent Application
CHIP MOUNTING STRUCTURE
- Publication number 20180076162
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Akihiro HORIBE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATION OF SACRIFICIAL INTERPOSER TEST STRUCTURE
- Publication number 20170358507
- Publication date Dec 14, 2017
- International Business Machines Corporation
- Hiroyuki Mori
- G01 - MEASURING TESTING
Information Patent Application
WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS
- Publication number 20170309998
- Publication date Oct 26, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTING STRUCTURE
- Publication number 20170194277
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Keji Matsumodo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING WARPAGE OF AN ORGACNIC SUBSTRATE
- Publication number 20170142825
- Publication date May 18, 2017
- Sayuri Hada
- G01 - MEASURING TESTING
Information Patent Application
CHIP MOUNTING STRUCTURE
- Publication number 20170005053
- Publication date Jan 5, 2017
- International Business Machines Corporation
- Akihiro HORIBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FOR ELECTRICAL CONTACT PASSING THROUGH LAYERS OF OPTICAL WAVEGU...
- Publication number 20160246017
- Publication date Aug 25, 2016
- International Business Machines Corporation
- Hirokazu Noma
- G02 - OPTICS
Information Patent Application
CIRCUIT BOARD FORMATION USING ORGANIC SUBSTRATES
- Publication number 20160081187
- Publication date Mar 17, 2016
- International Business Machines Corporation
- Hiroyuki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD FORMATION USING ORGANIC SUBSTRATES
- Publication number 20160057857
- Publication date Feb 25, 2016
- International Business Machines Corporation
- Hiroyuki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS
- Publication number 20150380813
- Publication date Dec 31, 2015
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FOR ELECTRICAL CONTACT PASSING THROUGH LAYERS OF OPTICAL WAVEGU...
- Publication number 20150338589
- Publication date Nov 26, 2015
- International Business Machines Corporation
- Hirokazu Noma
- G02 - OPTICS
Information Patent Application
Solder Joint Fatigue Life Prediction Method
- Publication number 20130275096
- Publication date Oct 17, 2013
- Akifumi Yoshimura
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC PACKAGE FOR MILLIMETER WAVE SEMICONDUCTOR DIES
- Publication number 20130256850
- Publication date Oct 3, 2013
- International Business Machines Corporation
- Elad Danny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY TRANSITION MATCHING IN AN ELECTRONIC PACKAGE FOR MIL...
- Publication number 20130256849
- Publication date Oct 3, 2013
- International Business Machines Corporation
- Elad Danny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP INCORPORATING EMBEDDED THERMAL RADIATORS FO...
- Publication number 20120168416
- Publication date Jul 5, 2012
- International Business Machines Corporation
- Richard S. Graf
- G05 - CONTROLLING REGULATING

Keishi Okamoto

Person

Patents Grantslast 30 patents

Controlling of height of high-density interconnection structure on...

Prevention of bridging between solder joints

Interconnection with side connection to substrate

Controlling of height of high-density interconnection structure on...

Prevention of bridging between solder joints

Fabrication of a sacrificial interposer test structure

High-density interconnecting adhesive tape

Method of reducing warpage of an organic substrate

High-density interconnecting adhesive tape

Chip mounting structure

Fabrication of sacrificial interposer test structure

Wireless communication device with joined semiconductors

Method of reducing warpage of an orgacnic substrate

Electrical connecting structure between a substrate and a semicondu...

Chip mounting structure

Wireless communication device with joined semiconductors

Via for electrical contact passing through layers of optical wavegu...

Circuit board formation using organic substrates

Circuit board formation using organic substrates

Via for electrical contact passing through layers of optical wavegu...

Electronic package for millimeter wave semiconductor dies

High frequency transition matching in an electronic package for mil...

Integrated circuit chip incorporating embedded thermal radiators fo...

Patents Applicationslast 30 patents

CONTROLLING OF HEIGHT OF HIGH-DENSITY INTERCONNECTION STRUCTURE ON...

PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS

INTERCONNECTION WITH SIDE CONNECTION TO SUBSTRATE

PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS

CONTROLLING OF HEIGHT OF HIGH-DENSITY INTERCONNECTION STRUCTURE ON...

METHOD OF REDUCING WARPAGE OF AN ORGANIC SUBSTRATE

HIGH-DENSITY INTERCONNECTING ADHESIVE TAPE

HIGH-DENSITY INTERCONNECTING ADHESIVE TAPE

FABRICATION OF A SACRIFICIAL INTERPOSER TEST STRUCTURE

CHIP MOUNTING STRUCTURE

FABRICATION OF SACRIFICIAL INTERPOSER TEST STRUCTURE

WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS

ELECTRICAL CONNECTING STRUCTURE

METHOD OF REDUCING WARPAGE OF AN ORGACNIC SUBSTRATE

CHIP MOUNTING STRUCTURE

VIA FOR ELECTRICAL CONTACT PASSING THROUGH LAYERS OF OPTICAL WAVEGU...

CIRCUIT BOARD FORMATION USING ORGANIC SUBSTRATES

CIRCUIT BOARD FORMATION USING ORGANIC SUBSTRATES

WIRELESS COMMUNICATION DEVICE WITH JOINED SEMICONDUCTORS

VIA FOR ELECTRICAL CONTACT PASSING THROUGH LAYERS OF OPTICAL WAVEGU...

Solder Joint Fatigue Life Prediction Method

ELECTRONIC PACKAGE FOR MILLIMETER WAVE SEMICONDUCTOR DIES

HIGH FREQUENCY TRANSITION MATCHING IN AN ELECTRONIC PACKAGE FOR MIL...

INTEGRATED CIRCUIT CHIP INCORPORATING EMBEDDED THERMAL RADIATORS FO...