Keishi ONO

Person

Chiyoda-ku, Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive for semiconductor device, and high productivity method for...
- Patent number 11,608,455
- Issue date Mar 21, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing semiconductor device including heating and...
- Patent number 10,669,454
- Issue date Jun 2, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor adhesive, and semiconductor device and method for man...
- Patent number 10,224,311
- Issue date Mar 5, 2019
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND METHO...
- Publication number 20240402603
- Publication date Dec 5, 2024
- Resonac Corporation
- Yusaku WATANABE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20240341039
- Publication date Oct 10, 2024
- Resonac Corporation
- Kei TOGASAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PHOTOSENSITIVE RESIN FILM, RESIST PATTERN FORMING METHOD, AND WIRIN...
- Publication number 20240111211
- Publication date Apr 4, 2024
- Tatsuhiko ARAI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD, AND WIRING BOARD
- Publication number 20240015889
- Publication date Jan 11, 2024
- Resonac Corporation
- Kei TOGASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE FILM, PHOTOSENSITIVE ELEMENT, AND METHOD FOR PRODUCI...
- Publication number 20230161248
- Publication date May 25, 2023
- Showa Denko Materials Co., Ltd.
- Mao NARITA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND METHO...
- Publication number 20230145264
- Publication date May 11, 2023
- Keishi ONO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, METHOD...
- Publication number 20220267484
- Publication date Aug 25, 2022
- Showa Denko Materials Co., Ltd.
- Mao NARITA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20200095481
- Publication date Mar 26, 2020
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
- Publication number 20180312731
- Publication date Nov 1, 2018
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR ADHESIVE, AND SEMICONDUCTOR DEVICE AND METHOD FOR MAN...
- Publication number 20170345797
- Publication date Nov 30, 2017
- Hitachi Chemical Company, Ltd.
- Kazutaka HONDA
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Adhesive for semiconductor device, and high productivity method for...

Method for manufacturing semiconductor device including heating and...

Semiconductor adhesive, and semiconductor device and method for man...

Patents Applicationslast 30 patents

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND METHO...

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

PHOTOSENSITIVE RESIN FILM, RESIST PATTERN FORMING METHOD, AND WIRIN...

METHOD FOR PRODUCING WIRING BOARD, AND WIRING BOARD

PHOTOSENSITIVE FILM, PHOTOSENSITIVE ELEMENT, AND METHOD FOR PRODUCI...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND METHO...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, METHOD...

ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...

SEMICONDUCTOR ADHESIVE, AND SEMICONDUCTOR DEVICE AND METHOD FOR MAN...