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Keishiro Umemura
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Suginami-ku, JP
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Patents Grants
last 30 patents
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Patent Grant
Cement bonded wood chip product, resin bonded wood chip product, si...
Patent number
7,005,463
Issue date
Feb 28, 2006
Misawa Homes Co., Ltd.
Hidenori Taguchi
B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information
Patent Grant
Cement bonded wood chip product, resin bonded wood chip product, si...
Patent number
6,228,301
Issue date
May 8, 2001
Misawa Homes Co., Ltd.
Hidenori Taguchi
B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Patents Applications
last 30 patents
Information
Patent Application
Cement bonded wood chip product, resin bonded wood chip product, si...
Publication number
20010009309
Publication date
Jul 26, 2001
Misawa Homes Co., Ltd.
Hidenori Taguchi
B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...