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Keisuke Hayabusa

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  • Fujisawa, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Substrate plating method and apparatus
    • Patent number 7,918,983
    • Issue date Apr 5, 2011
    • Ebara Corporation
    • Yasuhiko Saijo
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    Plating apparatus and plating method
    • Publication number 20100163408
    • Publication date Jul 1, 2010
    • Keiichi Kurashina
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus and plating method
    • Publication number 20070238265
    • Publication date Oct 11, 2007
    • Keiichi Kurashina
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Substrate plating method and apparatus
    • Publication number 20070227894
    • Publication date Oct 4, 2007
    • Yasuhiko Saijo
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR