Keisuke Izumi

Person

Yokkaichi-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional memory device containing bridges for enhanced str...
- Patent number 11,532,570
- Issue date Dec 20, 2022
- SanDisk Technologies LLC
- Genta Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing apparatus containing hydraulic multi-...
- Patent number 10,593,603
- Issue date Mar 17, 2020
- SanDisk Technologies LLC
- Keisuke Izumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including inverted memory stack str...
- Patent number 10,381,362
- Issue date Aug 13, 2019
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposure focus leveling method using region-differentiated focus sc...
- Patent number 10,209,636
- Issue date Feb 19, 2019
- SanDisk Technologies LLC
- Tohru Toda
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multiheight contact via structures for a multilevel interconnect st...
- Patent number 9,691,778
- Issue date Jun 27, 2017
- SanDisk Technologies LLC
- Keisuke Izumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiheight contact via structures for a multilevel interconnect st...
- Patent number 9,601,502
- Issue date Mar 21, 2017
- SanDisk Technologies LLC
- Michiaki Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiheight electrically conductive via contacts for a multilevel i...
- Patent number 9,524,901
- Issue date Dec 20, 2016
- SanDisk Technologies LLC
- Keisuke Izumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiheight electrically conductive via contacts for a multilevel i...
- Patent number 9,412,753
- Issue date Aug 9, 2016
- SanDisk Technologies LLC
- Keisuke Izumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiheight contact via structures for a multilevel interconnect st...
- Patent number 9,401,309
- Issue date Jul 26, 2016
- SanDisk Technologies LLC
- Keisuke Izumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiheight electrically conductive via contacts for a multilevel i...
- Patent number 9,236,392
- Issue date Jan 12, 2016
- SanDisk Technologies Inc.
- Keisuke Izumi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH LAYER CONTACT VIA STRUCTURES L...
- Publication number 20240381639
- Publication date Nov 14, 2024
- Western Digital Technologies, Inc.
- Takaaki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THER...
- Publication number 20240178129
- Publication date May 30, 2024
- SANDISK TECHNOLOGIES LLC
- Takayuki MAEKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING BRIDGES FOR ENHANCED STR...
- Publication number 20220254733
- Publication date Aug 11, 2022
- SANDISK TECHNOLOGIES LLC
- Genta MIZUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS CONTAINING HYDRAULIC MULTI-...
- Publication number 20190287866
- Publication date Sep 19, 2019
- SanDisk Technologies LLC
- Keisuke IZUMI
- B24 - GRINDING POLISHING
Information Patent Application
MULTIHEIGHT CONTACT VIA STRUCTURES FOR A MULTILEVEL INTERCONNECT ST...
- Publication number 20160322374
- Publication date Nov 3, 2016
- SanDisk Technologies LLC
- Michiaki SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIHEIGHT CONTACT VIA STRUCTURES FOR A MULTILEVEL INTERCONNECT ST...
- Publication number 20160307912
- Publication date Oct 20, 2016
- SanDisk Technologies LLC
- Keisuke Izumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIHEIGHT ELECTRICALLY CONDUCTIVE VIA CONTACTS FOR A MULTILEVEL I...
- Publication number 20160093626
- Publication date Mar 31, 2016
- SANDISK TECHNOLOGIES INC.
- Keisuke Izumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIHEIGHT ELECTRICALLY CONDUCTIVE VIA CONTACTS FOR A MULTILEVEL I...
- Publication number 20160093524
- Publication date Mar 31, 2016
- SANDISK TECHNOLOGIES INC.
- Keisuke Izumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIHEIGHT CONTACT VIA STRUCTURES FOR A MULTILEVEL INTERCONNECT ST...
- Publication number 20160064281
- Publication date Mar 3, 2016
- SANDISK TECHNOLOGIES INC.
- Keisuke Izumi
- H01 - BASIC ELECTRIC ELEMENTS

Keisuke Izumi

Person

Patents Grantslast 30 patents

Three-dimensional memory device containing bridges for enhanced str...

Chemical mechanical polishing apparatus containing hydraulic multi-...

Three-dimensional memory device including inverted memory stack str...

Exposure focus leveling method using region-differentiated focus sc...

Multiheight contact via structures for a multilevel interconnect st...

Multiheight contact via structures for a multilevel interconnect st...

Multiheight electrically conductive via contacts for a multilevel i...

Multiheight electrically conductive via contacts for a multilevel i...

Multiheight contact via structures for a multilevel interconnect st...

Multiheight electrically conductive via contacts for a multilevel i...

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICE WITH LAYER CONTACT VIA STRUCTURES L...

STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THER...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING BRIDGES FOR ENHANCED STR...

CHEMICAL MECHANICAL POLISHING APPARATUS CONTAINING HYDRAULIC MULTI-...

MULTIHEIGHT CONTACT VIA STRUCTURES FOR A MULTILEVEL INTERCONNECT ST...

MULTIHEIGHT CONTACT VIA STRUCTURES FOR A MULTILEVEL INTERCONNECT ST...

MULTIHEIGHT ELECTRICALLY CONDUCTIVE VIA CONTACTS FOR A MULTILEVEL I...

MULTIHEIGHT ELECTRICALLY CONDUCTIVE VIA CONTACTS FOR A MULTILEVEL I...

MULTIHEIGHT CONTACT VIA STRUCTURES FOR A MULTILEVEL INTERCONNECT ST...