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Keisuke NABA

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  • Chuo-ku, Tokyo, JP
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Patents Applicationslast 30 patents

  • Information Patent Application

    COVER TAPE AND ELECTRONIC-COMPONENT PACKAGE
    • Publication number 20230271761
    • Publication date Aug 31, 2023
    • Denka Company Limited
    • Keisuke NABA
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Application

    COVER TAPE AND ELECTRONIC COMPONENT PACKAGE
    • Publication number 20230272192
    • Publication date Aug 31, 2023
    • Denka Company Limited
    • Kota SAWAGUCHI
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    COVER TAPE AND ELECTRONIC COMPONENT PACKAGE
    • Publication number 20230265317
    • Publication date Aug 24, 2023
    • Denka Company Limited
    • Gosuke NAKAJIMA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...