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Keisuke Oguma

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  • Osaka, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Low dielectric resin composition, molded article, film, multilayer...
    • Patent number 11,993,740
    • Issue date May 28, 2024
    • Kaneka Corporation
    • Yuichi Imamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Antenna device
    • Patent number 11,984,674
    • Issue date May 14, 2024
    • Zeon Corporation
    • Seiki Chiba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    High frequency filter
    • Patent number 11,894,592
    • Issue date Feb 6, 2024
    • Zeon Corporation
    • Seiki Chiba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Heat dissipation structure
    • Patent number 10,356,946
    • Issue date Jul 16, 2019
    • Kaneka Corporation
    • Keisuke Oguma
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Heat dissipating structure
    • Patent number 9,826,623
    • Issue date Nov 21, 2017
    • Kaneka Corporation
    • Aki Koukami
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    NON-THERMOPLASTIC POLYIMIDE FILM, MULTI-LAYERED POLYIMIDE FILM AND...
    • Publication number 20230265252
    • Publication date Aug 24, 2023
    • Kaneka Corporation
    • Takahiro Sato
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    HIGH FREQUENCY FILTER
    • Publication number 20220336938
    • Publication date Oct 20, 2022
    • ZEON CORPORATION
    • Seiki CHIBA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ANTENNA DEVICE
    • Publication number 20220294117
    • Publication date Sep 15, 2022
    • ZEON CORPORATION
    • Seiki CHIBA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW DIELECTRIC RESIN COMPOSITION, MOLDED ARTICLE, FILM, MULTILAYER...
    • Publication number 20220041932
    • Publication date Feb 10, 2022
    • Kaneka Corporation
    • Yuichi Imamura
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    HEAT DISSIPATING STRUCTURE
    • Publication number 20160157334
    • Publication date Jun 2, 2016
    • Kaneka Corporation
    • Aki KOUKAMI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HEAT DISSIPATION STRUCTURE
    • Publication number 20150351217
    • Publication date Dec 3, 2015
    • Kaneka Corporation
    • Aki KOUKAMI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HEAT DISSIPATION STRUCTURE
    • Publication number 20150163958
    • Publication date Jun 11, 2015
    • Kaneka Corporation
    • Keisuke Oguma
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL