Keisuke TAKEDA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Amidinate compound, dimer compound thereof, thin-film forming raw m...
- Patent number 12,275,748
- Issue date Apr 15, 2025
- Adeka Corporation
- Tomoharu Yoshino
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Ruthenium compound, thin-film forming raw material, and method of p...
- Patent number 12,264,168
- Issue date Apr 1, 2025
- Adeka Corporation
- Masaki Enzu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Compound, thin-film forming raw material that contains said compoun...
- Patent number 12,104,245
- Issue date Oct 1, 2024
- Adeka Corporation
- Atsushi Sakurai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
THIN-FILM FORMING RAW MATERIAL USED IN ATOMIC LAYER DEPOSITION METH...
- Publication number 20250109296
- Publication date Apr 3, 2025
- ADEKA CORPORATION
- Keisuke TAKEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THIN-FILM FORMING RAW MATERIAL, METHOD OF PRODUCING THIN-FILM, THIN...
- Publication number 20240425975
- Publication date Dec 26, 2024
- ADEKA CORPORATION
- Masako HATASE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COBALT COMPOUND, THIN-FILM FORMING RAW MATERIAL, THIN-FILM, AND MET...
- Publication number 20240337014
- Publication date Oct 10, 2024
- ADEKA CORPORATION
- Tomoharu YOSHINO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THIN-FILM FORMING RAW MATERIAL, WHICH IS USED IN ATOMIC LAYER DEPOS...
- Publication number 20240167154
- Publication date May 23, 2024
- ADEKA CORPORATION
- Atsushi SAKURAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INDIUM COMPOUND, THIN-FILM FORMING RAW MATERIAL, THIN FILM, AND MET...
- Publication number 20240060177
- Publication date Feb 22, 2024
- ADEKA CORPORATION
- Keisuke TAKEDA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
THIN-FILM FORMING RAW MATERIAL USED IN ATOMIC LAYER DEPOSITION METH...
- Publication number 20230151220
- Publication date May 18, 2023
- ADEKA CORPORATION
- Keisuke TAKEDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AMIDINATE COMPOUND, DIMER COMPOUND THEREOF, THIN-FILM FORMING RAW M...
- Publication number 20230151041
- Publication date May 18, 2023
- ADEKA CORPORATION
- Tomoharu YOSHINO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ZINC COMPOUND, THIN-FILM FORMING RAW MATERIAL, THIN-FILM, AND METHO...
- Publication number 20230142848
- Publication date May 11, 2023
- ADEKA CORPORATION
- Ryota FUKUSHIMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NOVEL COMPOUND, THIN-FILM FORMING RAW MATERIAL THAT CONTAINS SAID C...
- Publication number 20220389570
- Publication date Dec 8, 2022
- ADEKA CORPORATION
- Atsushi SAKURAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RUTHENIUM COMPOUND, THIN-FILM FORMING RAW MATERIAL, AND METHOD OF P...
- Publication number 20220372056
- Publication date Nov 24, 2022
- ADEKA CORPORATION
- Masaki ENZU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RAW MATERIAL FOR FORMING THIN FILM BY ATOMIC LAYER DEPOSITION METHO...
- Publication number 20210155638
- Publication date May 27, 2021
- ADEKA CORPORATION
- Masaki ENZU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Keisuke TAKEDA

Person

Patents Grantslast 30 patents

Amidinate compound, dimer compound thereof, thin-film forming raw m...

Ruthenium compound, thin-film forming raw material, and method of p...

Compound, thin-film forming raw material that contains said compoun...

Patents Applicationslast 30 patents

THIN-FILM FORMING RAW MATERIAL USED IN ATOMIC LAYER DEPOSITION METH...

THIN-FILM FORMING RAW MATERIAL, METHOD OF PRODUCING THIN-FILM, THIN...

COBALT COMPOUND, THIN-FILM FORMING RAW MATERIAL, THIN-FILM, AND MET...

THIN-FILM FORMING RAW MATERIAL, WHICH IS USED IN ATOMIC LAYER DEPOS...

INDIUM COMPOUND, THIN-FILM FORMING RAW MATERIAL, THIN FILM, AND MET...

THIN-FILM FORMING RAW MATERIAL USED IN ATOMIC LAYER DEPOSITION METH...

AMIDINATE COMPOUND, DIMER COMPOUND THEREOF, THIN-FILM FORMING RAW M...

ZINC COMPOUND, THIN-FILM FORMING RAW MATERIAL, THIN-FILM, AND METHO...

NOVEL COMPOUND, THIN-FILM FORMING RAW MATERIAL THAT CONTAINS SAID C...

RUTHENIUM COMPOUND, THIN-FILM FORMING RAW MATERIAL, AND METHOD OF P...

RAW MATERIAL FOR FORMING THIN FILM BY ATOMIC LAYER DEPOSITION METHO...