Keisuke UEDA

Person

  • Kawasaki-shi, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Substrate processing apparatus

    • Patent number 9,822,450
    • Issue date Nov 21, 2017
    • Canon Anelva Corporation
    • Toshikazu Nakazawa
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Sputtering apparatus

    • Patent number 9,368,331
    • Issue date Jun 14, 2016
    • Canon Anelva Corporation
    • Masato Shinada
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Substrate processing apparatus

    • Patent number 9,127,355
    • Issue date Sep 8, 2015
    • Canon Anelva Corporation
    • Toshikazu Nakazawa
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Substrate processing apparatus

    • Patent number 9,085,820
    • Issue date Jul 21, 2015
    • Canon Anelva Corporation
    • Toshikazu Nakazawa
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    SPUTTERING APPARATUS

    • Publication number 20150303042
    • Publication date Oct 22, 2015
    • Canon ANELVA Corporation
    • MASATO SHINADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE PROCESSING APPARATUS

    • Publication number 20140261182
    • Publication date Sep 18, 2014
    • Canon ANELVA Corporation
    • Toshikazu NAKAZAWA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    SUBSTRATE PROCESSING APPARATUS

    • Publication number 20130161187
    • Publication date Jun 27, 2013
    • Canon ANELVA Corporation
    • Toshikazu NAKAZAWA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...