Keisuke Yamanishi

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Banding band
- Patent number 11,738,921
- Issue date Aug 29, 2023
- Sumitomo Chemical Company, Limited
- Keisuke Yamanishi
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Liquid-crystalline resin composition and molded article
- Patent number 11,447,628
- Issue date Sep 20, 2022
- Sumitomo Chemical Company, Limited
- Keisuke Yamanishi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Rolled copper foil or electrolytic copper foil for electronic circu...
- Patent number 8,668,994
- Issue date Mar 11, 2014
- JX Nippon Mining & Metals Corporation
- Keisuke Yamanishi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Rolled copper foil or electrolytic copper foil for electronic circu...
- Patent number 8,580,390
- Issue date Nov 12, 2013
- JX Nippon Mining & Metals Corporation
- Keisuke Yamanishi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Rolled copper or copper alloy foil with roughened surface and metho...
- Patent number 8,449,987
- Issue date May 28, 2013
- JX Nippon Mining & Metals Corporation
- Yousuke Kobayashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of forming electronic circuit
- Patent number 8,357,307
- Issue date Jan 22, 2013
- JX Nippon Mining & Metals Corporation
- Keisuke Yamanishi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of roughening rolled copper or copper alloy foil
- Patent number 8,252,166
- Issue date Aug 28, 2012
- JX Nippon Mining & Metals Corporation
- Yousuke Kobayashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
BANDING BAND
- Publication number 20210009325
- Publication date Jan 14, 2021
- Sumitomo Chemical Company, Limited
- Keisuke YAMANISHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIQUID-CRYSTALLINE RESIN COMPOSITION
- Publication number 20200216642
- Publication date Jul 9, 2020
- Sumitomo Chemical Company, Limited
- Takayuki SUGIYAMA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIQUID-CRYSTALLINE RESIN COMPOSITION AND MOLDED ARTICLE
- Publication number 20190211204
- Publication date Jul 11, 2019
- Sumitomo Chemical Company, Limited
- Keisuke YAMANISHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...
- Publication number 20130270218
- Publication date Oct 17, 2013
- Keisuke Yamanishi
- B32 - LAYERED PRODUCTS
Information Patent Application
LAMINATE FOR FLEXIBLE WIRING
- Publication number 20130071652
- Publication date Mar 21, 2013
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC CIRCUIT, METHOD FOR FORMING SAME, AND COPPER CLAD LAMINA...
- Publication number 20120318568
- Publication date Dec 20, 2012
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of Roughening Rolled Copper or Copper Alloy Foil
- Publication number 20120012463
- Publication date Jan 19, 2012
- JX NIPPON MINING & METALS CORPORATION
- Yousuke Kobayashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...
- Publication number 20110300401
- Publication date Dec 8, 2011
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...
- Publication number 20110297641
- Publication date Dec 8, 2011
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...
- Publication number 20110293960
- Publication date Dec 1, 2011
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of Forming Electronic Circuit
- Publication number 20110284496
- Publication date Nov 24, 2011
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...
- Publication number 20110259848
- Publication date Oct 27, 2011
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Rolled Copper or Copper Alloy Foil with Roughened Surface and Metho...
- Publication number 20090162685
- Publication date Jun 25, 2009
- Nippon Mining & Metals Co., Ltd.
- Yousuke Kobayashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Keisuke Yamanishi

Person

Patents Grantslast 30 patents

Banding band

Liquid-crystalline resin composition and molded article

Rolled copper foil or electrolytic copper foil for electronic circu...

Rolled copper foil or electrolytic copper foil for electronic circu...

Rolled copper or copper alloy foil with roughened surface and metho...

Method of forming electronic circuit

Method of roughening rolled copper or copper alloy foil

Patents Applicationslast 30 patents

BANDING BAND

LIQUID-CRYSTALLINE RESIN COMPOSITION

LIQUID-CRYSTALLINE RESIN COMPOSITION AND MOLDED ARTICLE

Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...

LAMINATE FOR FLEXIBLE WIRING

ELECTRONIC CIRCUIT, METHOD FOR FORMING SAME, AND COPPER CLAD LAMINA...

Method of Roughening Rolled Copper or Copper Alloy Foil

Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...

Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...

Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...

Method of Forming Electronic Circuit

Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...

Rolled Copper or Copper Alloy Foil with Roughened Surface and Metho...