Keisuke YOSHIKAWA

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Magnetic field sensor, as well as magnetic field measurement method...
- Patent number 9,052,354
- Issue date Jun 9, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideki Takenaga
- G01 - MEASURING TESTING
Information Patent Grant
Monitor and control apparatus
- Patent number 8,560,090
- Issue date Oct 15, 2013
- Panasonic Corporation
- Tomoaki Sasaki
- G05 - CONTROLLING REGULATING
Information Patent Grant
Semiconductor device, substrate for producing semiconductor device...
- Patent number 8,525,351
- Issue date Sep 3, 2013
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monitoring and control device
- Patent number 8,340,787
- Issue date Dec 25, 2012
- Panasonic Corporation
- Keisuke Yoshikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, substrate for producing semiconductor device...
- Patent number 8,018,044
- Issue date Sep 13, 2011
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, substrate for producing semiconductor device...
- Patent number 7,943,427
- Issue date May 17, 2011
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabricating apparatus and semiconductor device...
- Patent number 7,365,441
- Issue date Apr 29, 2008
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing epoxy resin composition for semiconductor enca...
- Patent number 7,268,191
- Issue date Sep 11, 2007
- Nitto Denko Corporation
- Eiji Toyoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation, semiconduc...
- Patent number 7,262,514
- Issue date Aug 28, 2007
- Nitto Denko Corporation
- Keisuke Yoshikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive film for manufacturing semiconductor device
- Patent number 7,132,755
- Issue date Nov 7, 2006
- Nitto Denko Corporation
- Kazuhito Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabricating apparatus and semiconductor device...
- Patent number 7,064,011
- Issue date Jun 20, 2006
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RECEPTACLE AND PLUG
- Publication number 20130194734
- Publication date Aug 1, 2013
- PANASONIC CORPORATION
- Keisuke YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC FIELD SENSOR, AS WELL AS MAGNETIC FIELD MEASUREMENT METHOD...
- Publication number 20120229131
- Publication date Sep 13, 2012
- PANASONIC CORPORATION
- Hideki Takenaga
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device, Substrate for Producing Semiconductor Device...
- Publication number 20110291303
- Publication date Dec 1, 2011
- Nitto Denko Corporation
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Substrate for Producing Semiconductor Device...
- Publication number 20080048311
- Publication date Feb 28, 2008
- DAI NIPPON PRINTING CO., LTD.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Substrate for Producing Semiconductor Device...
- Publication number 20070241445
- Publication date Oct 18, 2007
- DAI NIPPON PRINTING CO., LTD.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device fabricating apparatus and semiconductor device...
- Publication number 20060145363
- Publication date Jul 6, 2006
- DAI NIPPON PRINTING CO., LTD.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epoxy resin composition for semiconductor encapsulation, semiconduc...
- Publication number 20050253286
- Publication date Nov 17, 2005
- NITTO DENKO CORPORATION
- Keisuke Yoshikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for producing epoxy resin composition for semiconductor enca...
- Publication number 20050154152
- Publication date Jul 14, 2005
- NITTO DENKO CORPORATION
- Eiji Toyoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive film for manufacturing semiconductor device
- Publication number 20050133936
- Publication date Jun 23, 2005
- NITTO DENKO CORPORATION
- Kazuhito Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device fabricating apparatus and semiconductor device...
- Publication number 20040164387
- Publication date Aug 26, 2004
- Dai Nippon Printing Co., Ltd.
- Chikao Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS

Keisuke YOSHIKAWA

Person

Patents Grantslast 30 patents

Magnetic field sensor, as well as magnetic field measurement method...

Monitor and control apparatus

Semiconductor device, substrate for producing semiconductor device...

Monitoring and control device

Semiconductor device, substrate for producing semiconductor device...

Semiconductor device, substrate for producing semiconductor device...

Semiconductor device fabricating apparatus and semiconductor device...

Method for producing epoxy resin composition for semiconductor enca...

Epoxy resin composition for semiconductor encapsulation, semiconduc...

Adhesive film for manufacturing semiconductor device

Semiconductor device fabricating apparatus and semiconductor device...

Patents Applicationslast 30 patents

RECEPTACLE AND PLUG

MAGNETIC FIELD SENSOR, AS WELL AS MAGNETIC FIELD MEASUREMENT METHOD...

Semiconductor Device, Substrate for Producing Semiconductor Device...

Semiconductor Device, Substrate for Producing Semiconductor Device...

Semiconductor Device, Substrate for Producing Semiconductor Device...

Semiconductor device fabricating apparatus and semiconductor device...

Epoxy resin composition for semiconductor encapsulation, semiconduc...

Method for producing epoxy resin composition for semiconductor enca...

Adhesive film for manufacturing semiconductor device

Semiconductor device fabricating apparatus and semiconductor device...