Keita YAMAMOTO

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Minami-Alps, JP

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Patents Grantslast 30 patents

Information Patent Grant
Die bonding apparatus and manufacturing method for semiconductor de...
- Patent number 12,068,275
- Issue date Aug 20, 2024
- FASFORD TECHNOLOGY CO., LTD.
- Ryo Saegusa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, CARRIER JIG, AND MANUFACTURI...
- Publication number 20230290666
- Publication date Sep 14, 2023
- Fasford Technology Co., Ltd.
- Keita YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, INSPECTION APPARATUS, AND MA...
- Publication number 20230215770
- Publication date Jul 6, 2023
- Fasford Technology Co., Ltd.
- Hideharu KOBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding Apparatus and Manufacturing Method for Semiconductor De...
- Publication number 20220052017
- Publication date Feb 17, 2022
- Fasford Technology Co., Ltd.
- Ryo SAEGUSA
- H01 - BASIC ELECTRIC ELEMENTS