Keita Yamamoto

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Kumagaya-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Pick-up method of die bonder and die bonder
- Patent number 9,343,338
- Issue date May 17, 2016
- FASFORD TECHNOLOGY CO., LTD.
- Naoki Okamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Die bonding apparatus, die picking up apparatus and die picking up...
- Patent number 9,245,778
- Issue date Jan 26, 2016
- FASFORD TECHNOLOGY CO., LTD.
- Keita Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Die Bonding Apparatus, Die Picking Up Apparatus And Die Picking Up...
- Publication number 20140060751
- Publication date Mar 6, 2014
- Hitachi High-Tech Instruments Co., Ltd.
- Keita Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pick-Up Method of Die Bonder and Die Bonder
- Publication number 20120244647
- Publication date Sep 27, 2012
- Hitachi High-Tech Instruments Co., Ltd.
- Naoki OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS